Enhanced TDS
Identification & Functionality
Features & Benefits
- Ready-to-Use Product Features
- Features and Benefits
- 1K and no need mixing
- Fast curing
- Good storage stability
- High flow ability and good reliability
Applications & Uses
- Markets
- Applications
- Application Area
- Typical Applications
Encapsulation and protection of electronics parts.
- Directions for Use
1. Do not open the package before complete the thawing.
2. Thawing to room temperature (25°C) before using.
3. Seal any remaining material and store immediately at 2-8℃.
4. Preheating temp. to 30-45℃.
Properties
- Color
- Physical Form
- Appearance
- Black liquid
- Electrical Properties
Value Units Test Method / Conditions Dielectric Constant (at 1KHz) 3.3/0.018 - - Dielectric Constant (at 100KHz) 3.3/0.02 - - Volume Resistivity 4.1 x 10¹⁶ Ω.cm - Surface Resistivity 1.3 x 10¹⁶ ohm - Dielectric Strength 16.2 kV/mm - - Cured Properties
Value Units Test Method / Conditions Hardness 87.0 - Shore D Glass Transition Temperature 129.0 °C - Coefficient of Thermal Expansion (Alpha 1) 58.0 m/m.°C - Coefficient of Thermal Expansion (Aplha 2) 185.0 m/m.°C - Water Absorption(24h) 0.06 % - - Uncured Properties
Value Units Test Method / Conditions Viscosity (Brookfield, spindle 7, 10 rpm) 36400.0 mPa.s - Density 1.1 g/cm³ - Pot Life 3.0 months -
Technical Details & Test Data
- Recommend Curing Profile
150℃ 20 min。
It depends on the heating efficiency and the thickness of PCB and size of die. We suggest to adjust curing temperature and curing time according to heating device and adherent.
Packaging & Availability
- Regional Availability
Storage & Handling
- Storage Conditions
FH8731 is supplied in 500ml/barrels
It should be stored in 2-8°C refrigerator.
Shelf life is 12 months from date of manufacture.