Products

H.B. Fuller FH8516 is a two-part, room-temperature-curing epoxy adhesive that offers high strength, good flexibility, and excellent impact strength after curing. This product is specifically designed for bonding a variety of substrates, including composite, metal, glass, and ceramic, where high reliability is needed.

H.B. Fuller FH8707HF is a black-colored epoxy-based adhesive designed for a wide range of applications in electronic components, printed circuit boards (PCBs), electric motors, and automotive electrical and electronic systems. This heat-curable adhesive offers excellent filling properties, high strength, and good electrical properties. It exhibits improved aging resistance, ensuring long-term durability.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

H.B. Fuller EA6034 is a one-component UV adhesive that cures quickly and is specifically designed for reinforcing Flexible Printed Circuit (FPC) applications. The adhesive dries to a non-tacky surface and offers excellent flexibility. Additionally, this adhesive is fast-curing and does not require mixing.

H.B. Fuller FH6501 is a one-part epoxy adhesive specifically designed for potting and bonding electronic components. It is a heat-curable epoxy that offers excellent thermal conductivity. This product is commonly used in applications requiring thermally conductive properties, such as in electric motors.

H.B. Fuller EA6042 is a high-performance, fluorescence, fast UV-cure adhesive and encapsulant. This product has a tack-free surface finish and good electrical insulation performance. It has excellent precision dispensing and jetting performance. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. It has excellent adhesion and is flexible.

Double Bubble Epoxy Extra Fast Setting is a two-component, room temperature curing epoxy adhesive with an extra-fast setting time. It cures at temperatures as low as –18°C (0°F) and has a convenient mix ratio. Known for its excellent cohesive strength, it bonds to various substrates including metal, wood, concrete, ceramics, and many plastics. Ideal for fast patching, fixturing, and repairs requiring quick handling strength, it serves as an excellent general-purpose adhesive.

H.B. Fuller FH8009 is a brown-colored epoxy-based underfill adhesive designed for electronic components, particularly printed circuit boards (PCBs). This ready-to-use product offers excellent flow properties, ensuring smooth and precise application. FH8009 provides high reliability, ensuring secure and long-lasting bonding of components.

H.B. Fuller FH1007 is a modified silicone. This adhesive is known for its fast curing speed, making it suitable for assembly applications where efficiency and productivity are important. It offers the advantage of rapid bonding, allowing for faster production processes. One of the key benefits of H.B. Fuller FH1007 is its versatility in bonding different substrates, including metal, glass, and most plastics. The adhesive's moisture-curing properties make it well-suited for applications requiring moisture resistance. It can effectively bond substrates in environments with varying levels of moisture.

H.B. Fuller EA6202 is a fast UV-cured adhesive with medium viscosity. It is a general-purpose, one-component adhesive with good gap flow. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6202 has shown excellent adhesion and is flexible.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller EA6203 is a fast UV-cured adhesive with high viscosity. It is a general-purpose, one-component adhesive that does not require mixing. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6203 has shown excellent adhesion and is flexible.

H.B. Fuller EH9641 is a fast-setting reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture cure system. This material is applied warm and sets immediately, allowing handling without the need for heat curing. H.B. Fuller EH9641 has optimum adhesion to a wide range of substrates, including glass, aluminum, stainless steel, and common engineered plastics such as polycarbonate.

H.B. Fuller EV Therm 601 is a one-component UV curable technology that is thermally conductive, flame retardant, and electrically insulative. This material provides an optimum coating with a minimum coating thickness of 150 microns and encapsulation protection for electronic assemblies and components. This material was designed to be thermally conductive and is recommended for use with heatsinks, heat spreaders, cold plates, cooling tubes, and other thermal dissipation applications.

H.B. Fuller FH8801 is a one-part acrylate adhesive that undergoes heat curing. It offers fast curing at low temperatures and provides outstanding bond strength. This adhesive is commonly used for chip bonding in microelectronic, MEMS, and opto-electronic applications. It is especially suitable for in-line production as it has the ability to snap cure. FH8801 is an ideal heat cure acrylic for chip bonding and other electronics applications, including electric motors.