Products

H.B. Fuller EA6053H is a fast-curing adhesive that utilizes UV light to cure. The product possesses a soft and flexible nature, while also exhibiting excellent adhesion properties. This adhesive can be used as a replacement for silicone rings in buffering applications. It is capable of providing good adhesion to a variety of substrates, including glass, plastics, and metals.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller 1536 is a gray, flowable, one-component, neutral alkoxy-cure silicone sealant. Low-odor, solvent-free materials cure at room temperature when exposed to moisture in the atmosphere. With fast tacky-free time and meets the UL94-V0 flame rating. Excellent adhesion to glass, ABS, FR4, and PCBs. Superior resistance to thermal cycling, damp heat, and damp freezing Typical applications include electronics encapsulation, connector staking, electronics potting, circuit board encapsulation, electrical component reinforcement, electronic component bonding, and sealing.

H.B. Fuller EA6114 is a high-performance, fluorescence, fast UV/moisture dual-cure adhesive/encapsulant. It is optimized for fast moisture curing, supporting increased manufacturing productivity. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. This product has a tack-free surface finish and has shown excellent adhesion and flexibility. It can be moisture-cured in shadowed areas.

H.B. Fuller EA6202 is a fast UV-cured adhesive with medium viscosity. It is a general-purpose, one-component adhesive with good gap flow. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6202 has shown excellent adhesion and is flexible.

H.B. Fuller EA6037 is a fast UV-cure adhesive. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6037 has shown excellent adhesion and is flexible. It can be used for BGA reinforcement.

Tonsan® SN103W is a highly regarded silicone adhesive that boasts a de-alcohol formulation, a low odor, and excellent non-yellowing properties. Engineered for the specific purpose of sealing and bonding electronic and electrical equipment, it is a perfect fit for electric vehicles.

H.B. Fuller FH6501 is a one-part epoxy adhesive specifically designed for potting and bonding electronic components. It is a heat-curable epoxy that offers excellent thermal conductivity. This product is commonly used in applications requiring thermally conductive properties, such as in electric motors.

H.B. Fuller FH1007 is a modified silicone. This adhesive is known for its fast curing speed, making it suitable for assembly applications where efficiency and productivity are important. It offers the advantage of rapid bonding, allowing for faster production processes. One of the key benefits of H.B. Fuller FH1007 is its versatility in bonding different substrates, including metal, glass, and most plastics. The adhesive's moisture-curing properties make it well-suited for applications requiring moisture resistance. It can effectively bond substrates in environments with varying levels of moisture.

H.B. Fuller EA6062 is a fast UV-cure adhesive with a high depth of cure. This product is very soft and flexible and has excellent adhesion and dimensional stability after dispensing. It can be used as a re-enterable form-in-place or cure-in-place gasket material. H.B. Fuller EA6062 has excellent compressibility, elastic recovery, and low compression set.

H.B. Fuller EA6034 is a one-component UV adhesive that cures quickly and is specifically designed for reinforcing Flexible Printed Circuit (FPC) applications. The adhesive dries to a non-tacky surface and offers excellent flexibility. Additionally, this adhesive is fast-curing and does not require mixing.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

H.B. Fuller EA6206 is a one-component, ultraviolet light-curable adhesive designed for LCD terminal pin bonding applications. The cured adhesive exhibits high flexibility and toughness, good moisture resistance, and good chemical resistance. The product offers excellent adhesion to glass and is ideal for applications such as flat panel displays (FPD).

H.B. Fuller EH9641 is a fast-setting reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture cure system. This material is applied warm and sets immediately, allowing handling without the need for heat curing. H.B. Fuller EH9641 has optimum adhesion to a wide range of substrates, including glass, aluminum, stainless steel, and common engineered plastics such as polycarbonate.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.