Products

H.B. Fuller 1581 is a one-component, alcohol-cured RTV silicone sealant. A non-sag material with excellent heat resistance for use in industrial and electronics applications. 1581 has very good adhesion to a wide range of unprimed substrates. High performance with fast and excellent adhesion to glass, aluminum alloys, etc. It can be used for a variety of electronics bonding, encapsulation, and sealing applications. This material is certified by UL to pass HB flame rating testing. This material performs at temperatures ranging from -55°C to 210°C.

H.B. Fuller FH8801 is a one-part acrylate adhesive that undergoes heat curing. It offers fast curing at low temperatures and provides outstanding bond strength. This adhesive is commonly used for chip bonding in microelectronic, MEMS, and opto-electronic applications. It is especially suitable for in-line production as it has the ability to snap cure. FH8801 is an ideal heat cure acrylic for chip bonding and other electronics applications, including electric motors.

H.B. Fuller FH8017M is a black-colored epoxy-based underfill adhesive specifically designed for electronic components, including printed circuit boards (PCBs) and batteries. This ready-to-use product offers excellent flow properties, ensuring smooth and precise application. It provides good bonding strength, resulting in reliable and secure adhesion.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

H.B. Fuller EA6114 is a high-performance, fluorescence, fast UV/moisture dual-cure adhesive/encapsulant. It is optimized for fast moisture curing, supporting increased manufacturing productivity. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. This product has a tack-free surface finish and has shown excellent adhesion and flexibility. It can be moisture-cured in shadowed areas.

H.B. Fuller EH9641 is a fast-setting reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture cure system. This material is applied warm and sets immediately, allowing handling without the need for heat curing. H.B. Fuller EH9641 has optimum adhesion to a wide range of substrates, including glass, aluminum, stainless steel, and common engineered plastics such as polycarbonate.

Adcobond SCT-100 is a double-sided tape featuring a synthetic elastomer-based adhesive/sealant with a non-woven reinforcement layer. It maintains flexibility and easily conforms to irregular surfaces. This tape has a high tack level, forming strong bonds with various substrates such as polyethylene, EVA, EPDM, and automotive paint systems. Moreover, it establishes a permanent seal against moisture, dust, and air intrusion. The reinforcement layer adds strength and resistance to deformation.

H.B. Fuller EA6110 is a double-cure adhesive that cures rapidly under UV light or ambient temperature and humidity. It is a no-flow adhesive that is specifically formulated for bonding plastics and metals, and can even cure in shadowed areas. It is ideal for applications that require fast curing times and excellent bonding properties.

H.B. Fuller FH8623 is an epoxy adhesive. This adhesive is known for its high-performance characteristics, making it suitable for demanding applications. One of the notable features and benefits of H.B. Fuller FH8623 is its ultra-fast curing property. Additionally, H.B. Fuller FH8623 offers high toughness, providing excellent strength and durability to bonded structures. H.B. Fuller FH8623 is primarily used for structure bonding in module applications.

H.B. Fuller FH8633 is a one-component, thermal-curable adhesive with fast curing at low temperatures, low shrinkage, and high adhesive strength. It can adhere to a variety of substrates and has excellent thermal performance, making it suitable for high-temperature applications. This material also provides high bond strength on various substrates.

H.B. Fuller 1527, also called 1527SBK, is a black, UL-certified, one-component RTV silicone with super resistance to weathering and ultra violet (UV). This material has very good adhesion without the need for primers to a wide range of substrates. It can be used for a variety of interior and exterior bonding and sealing applications. 1527 Black is formulated to perform at temperatures ranging from -54°C to 210°C.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller EA6042 is a high-performance, fluorescence, fast UV-cure adhesive and encapsulant. This product has a tack-free surface finish and good electrical insulation performance. It has excellent precision dispensing and jetting performance. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. It has excellent adhesion and is flexible.

H.B. Fuller EA6053H is a fast-curing adhesive that utilizes UV light to cure. The product possesses a soft and flexible nature, while also exhibiting excellent adhesion properties. This adhesive can be used as a replacement for silicone rings in buffering applications. It is capable of providing good adhesion to a variety of substrates, including glass, plastics, and metals.

Tonsan® SN103W is a highly regarded silicone adhesive that boasts a de-alcohol formulation, a low odor, and excellent non-yellowing properties. Engineered for the specific purpose of sealing and bonding electronic and electrical equipment, it is a perfect fit for electric vehicles.