H.B. Fuller FH8801

H.B. Fuller FH8801 is a one-part acrylate adhesive that undergoes heat curing. It offers fast curing at low temperatures and provides outstanding bond strength. This adhesive is commonly used for chip bonding in microelectronic, MEMS, and opto-electronic applications. It is especially suitable for in-line production as it has the ability to snap cure. FH8801 is an ideal heat cure acrylic for chip bonding and other electronics applications, including electric motors.

Chemical Family: Acrylics & Acrylates

Product Type: 1K (1 component) Adhesive, Contact Adhesive, Reactive Adhesive

Application Area: Chip Module, Electric Motors, Electronic Components, Microelectromechanical Systems (MEMS) Applications

Enhanced TDS

Identification & Functionality

Chemical Family

Applications & Uses

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Packaging & Availability

Regional Availability
  • Asia Pacific
  • Latin America
  • North America