Products

H.B. Fuller EA6031 is a general-purpose, low-viscosity, fast UV-cure adhesive with good flowability. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6031 has shown excellent adhesion and is flexible.

H.B. Fuller 1527B is a black, medium-viscosity, low-odor, good workability RTV silicone. Cures at room temperature when exposed to moisture. Excellent flexibility, adhesive property, electrical insulation, weather resistance, aging resistance, and thermal cycle resistance 1527B passes FDA 21 CFR 177.2600 and is UL-certified.

H.B. Fuller FH8707HF is a black-colored epoxy-based adhesive designed for a wide range of applications in electronic components, printed circuit boards (PCBs), electric motors, and automotive electrical and electronic systems. This heat-curable adhesive offers excellent filling properties, high strength, and good electrical properties. It exhibits improved aging resistance, ensuring long-term durability.

H.B. Fuller EV Protect 300 is a two-component, low viscosity polyurethane encapsulating system that is designed for potting and encapsulating of battery cells in battery modules. This product offers battery designers the ability to enhance safety and protection from thermal propagation.

H.B. Fuller FH1270 is a two-part polyurethane (PU) adhesive known for its high solids content and thermosetting properties. It is a non-toxic film used primarily as an insulating compound to coat printed circuit assemblies. This PU adhesive is designed to provide protection against moisture, mold, dust, corrosion, and other extreme environmental stresses. Its main applications include electronics protection and the insulation of electric motors.

H.B. Fuller FH1425 is a two-part epoxy adhesive specifically formulated for encapsulating and protecting electronics in challenging environments. This epoxy system offers flexibility, making it suitable for applications where the electronics require a high level of protection. Its primary use is for the protection of electronics, including electric motors, where a highly flexible epoxy resin system is required.

H.B. Fuller EA6042 is a high-performance, fluorescence, fast UV-cure adhesive and encapsulant. This product has a tack-free surface finish and good electrical insulation performance. It has excellent precision dispensing and jetting performance. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. It has excellent adhesion and is flexible.

H.B. Fuller EA6056 is a fast UV-cure adhesive designed for waterproof applications. It is a very soft material when cured. This product has shown excellent adhesion and is flexible. It can be used to replace a silicone ring for buffering and waterproof applications.

H.B. Fuller EA6062 is a fast UV-cure adhesive with a high depth of cure. This product is very soft and flexible and has excellent adhesion and dimensional stability after dispensing. It can be used as a re-enterable form-in-place or cure-in-place gasket material. H.B. Fuller EA6062 has excellent compressibility, elastic recovery, and low compression set.

H.B. Fuller FH8626 is a one-component, low-temperature-curing epoxy adhesive. This material features fast curing at low temperatures, low shrinkage, high adhesive strength, and adhesion to a variety of substrates. FH8626 will cure faster with increased temperature and has a low modulus to prevent warpage.

H.B. Fuller FH7026 is a two-part, room-temperature-curing acrylic adhesive. This material is designed to meet the requirements for structural bonding in electronic assemblies. It cures rapidly at room temperature, and the cure times can be reduced with the addition of mild heat to the bonded assemblies. This product also provides excellent adhesion and is flexible.

H.B. Fuller FH8623 is an epoxy adhesive. This adhesive is known for its high-performance characteristics, making it suitable for demanding applications. One of the notable features and benefits of H.B. Fuller FH8623 is its ultra-fast curing property. Additionally, H.B. Fuller FH8623 offers high toughness, providing excellent strength and durability to bonded structures. H.B. Fuller FH8623 is primarily used for structure bonding in module applications.

H.B. Fuller FH8516 is a two-part, room-temperature-curing epoxy adhesive that offers high strength, good flexibility, and excellent impact strength after curing. This product is specifically designed for bonding a variety of substrates, including composite, metal, glass, and ceramic, where high reliability is needed.

H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.

Tonsan® EP843 is an epoxy adhesive known for its high strength and heat resistance, capable of withstanding temperatures up to 150°C in the long term and 180°C in the short term. It has a high viscosity, making it suitable for potting bonding applications where thixotropic properties are desired, preventing flow on vertical surfaces. This adhesive is specifically designed for bonding metal and other parts in high-temperature and harsh conditions, making it ideal for use in the electric vehicle industry.