Products

H.B. Fuller EA6053H is a fast-curing adhesive that utilizes UV light to cure. The product possesses a soft and flexible nature, while also exhibiting excellent adhesion properties. This adhesive can be used as a replacement for silicone rings in buffering applications. It is capable of providing good adhesion to a variety of substrates, including glass, plastics, and metals.

H.B. Fuller FH1270 is a two-part polyurethane (PU) adhesive known for its high solids content and thermosetting properties. It is a non-toxic film used primarily as an insulating compound to coat printed circuit assemblies. This PU adhesive is designed to provide protection against moisture, mold, dust, corrosion, and other extreme environmental stresses. Its main applications include electronics protection and the insulation of electric motors.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller 1536 is a gray, flowable, one-component, neutral alkoxy-cure silicone sealant. Low-odor, solvent-free materials cure at room temperature when exposed to moisture in the atmosphere. With fast tacky-free time and meets the UL94-V0 flame rating. Excellent adhesion to glass, ABS, FR4, and PCBs. Superior resistance to thermal cycling, damp heat, and damp freezing Typical applications include electronics encapsulation, connector staking, electronics potting, circuit board encapsulation, electrical component reinforcement, electronic component bonding, and sealing.

H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.

H.B. Fuller EU2002HV is a solvent-based adhesive with excellent mechanical and chemical resistance. However, one distinguishing characteristic of EU2002HV is its high viscosity. H.B. Fuller EU2002HV is primarily used for conformal coating applications, providing a protective layer on circuit boards. The low odor feature enhances the user experience by minimizing any unpleasant smells during the application process.

Tonsan® EP832 is an epoxy adhesive known for its high strength, good toughness, and heat resistance up to 150°C in the long term and 180°C in the short term. With its low viscosity, it is suitable for potting bonding and exhibits excellent bonding performance to metal, stone, wood, ceramic, and most plastics. This adhesive is commonly used in the electric vehicle industry.

H.B. Fuller EA6114 is a high-performance, fluorescence, fast UV/moisture dual-cure adhesive/encapsulant. It is optimized for fast moisture curing, supporting increased manufacturing productivity. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. This product has a tack-free surface finish and has shown excellent adhesion and flexibility. It can be moisture-cured in shadowed areas.

H.B. Fuller EA6202 is a fast UV-cured adhesive with medium viscosity. It is a general-purpose, one-component adhesive with good gap flow. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6202 has shown excellent adhesion and is flexible.

H.B. Fuller EA6037 is a fast UV-cure adhesive. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6037 has shown excellent adhesion and is flexible. It can be used for BGA reinforcement.

Tonsan® SN103W is a highly regarded silicone adhesive that boasts a de-alcohol formulation, a low odor, and excellent non-yellowing properties. Engineered for the specific purpose of sealing and bonding electronic and electrical equipment, it is a perfect fit for electric vehicles.

H.B. Fuller EA6062 is a fast UV-cure adhesive with a high depth of cure. This product is very soft and flexible and has excellent adhesion and dimensional stability after dispensing. It can be used as a re-enterable form-in-place or cure-in-place gasket material. H.B. Fuller EA6062 has excellent compressibility, elastic recovery, and low compression set.

H.B. Fuller FH4008AB is a two-component epoxy adhesive formulated for potting applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FH4008AB is its excellent isolation resistance. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. Another notable feature of H.B. Fuller FH4008AB is its resistance to aging hardening. This means that the adhesive maintains its performance and properties over time, even under prolonged exposure to various environmental conditions. Furthermore, H.B. Fuller FH4008AB offers a high service temperature, indicating its ability to withstand elevated temperatures without significant degradation.

H.B. Fuller EA6034 is a one-component UV adhesive that cures quickly and is specifically designed for reinforcing Flexible Printed Circuit (FPC) applications. The adhesive dries to a non-tacky surface and offers excellent flexibility. Additionally, this adhesive is fast-curing and does not require mixing.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.