Products

H.B. Fuller FH8805 is a single-component adhesive that cures by heat. It has fast curing at low temperatures and outstanding bond strength. This material is recommended for use with chip bonding in microelectronic, MEMS, and opto-electronic applications. This material is able to snap-cure during in-line production.

H.B. Fuller EA6034 is a one-component UV adhesive that cures quickly and is specifically designed for reinforcing Flexible Printed Circuit (FPC) applications. The adhesive dries to a non-tacky surface and offers excellent flexibility. Additionally, this adhesive is fast-curing and does not require mixing.

H.B. Fuller EA6202 is a fast UV-cured adhesive with medium viscosity. It is a general-purpose, one-component adhesive with good gap flow. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6202 has shown excellent adhesion and is flexible.

H.B. Fuller NP2075VF149 is a reactive hot melt adhesive known for its high performance and high green strength. As a one-component adhesive, it enables efficient manufacturing processes with high speed and low work-in-progress (WIP). It demonstrates excellent thermal stability during the production phase and boasts industry-leading heat resistance when exposed to in-lamp heat. This adhesive is primarily used for headlamp lens and housing bonding and exterior lighting applications.

H.B. Fuller EA6206 is a one-component, ultraviolet light-curable adhesive designed for LCD terminal pin bonding applications. The cured adhesive exhibits high flexibility and toughness, good moisture resistance, and good chemical resistance. The product offers excellent adhesion to glass and is ideal for applications such as flat panel displays (FPD).

H.B. Fuller EA6053H is a fast-curing adhesive that utilizes UV light to cure. The product possesses a soft and flexible nature, while also exhibiting excellent adhesion properties. This adhesive can be used as a replacement for silicone rings in buffering applications. It is capable of providing good adhesion to a variety of substrates, including glass, plastics, and metals.

H.B. Fuller EV Protect 300 is a two-component, low viscosity polyurethane encapsulating system that is designed for potting and encapsulating of battery cells in battery modules. This product offers battery designers the ability to enhance safety and protection from thermal propagation.

H.B. Fuller EA6056 is a fast UV-cure adhesive designed for waterproof applications. It is a very soft material when cured. This product has shown excellent adhesion and is flexible. It can be used to replace a silicone ring for buffering and waterproof applications.

H.B. Fuller FH8626 is a one-component, low-temperature-curing epoxy adhesive. This material features fast curing at low temperatures, low shrinkage, high adhesive strength, and adhesion to a variety of substrates. FH8626 will cure faster with increased temperature and has a low modulus to prevent warpage.

H.B. Fuller EA6205 is a one-component, ultraviolet light-curable adhesive designed for LCD terminal pin bonding applications. The cured adhesive exhibits characteristics of high flexibility and toughness, good moisture resistance, and good chemical resistance. The product offers excellent adhesion to glass and is ideal for applications such as flat panel displays (FPD).

H.B. Fuller FH4003AB is a general epoxy encapsulant. It falls under the epoxy category and is commonly used for charger handle encapsulation and general potting applications. This epoxy is specifically suitable for potting and encapsulating electric vehicles (EVs), providing effective encapsulation and protection for EV components.

H.B. Fuller 1527L is a low viscosity, one-component, neutral cure silicone adhesive and sealant. It is a UL94 certified flame retardant material with excellent adhesion to a wide range of substrates. This adhesive offers low/no odor and high heat resistance, as well as superior UV resistance and weather resistance.

H.B. Fuller EH9641 is a fast-setting reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture cure system. This material is applied warm and sets immediately, allowing handling without the need for heat curing. H.B. Fuller EH9641 has optimum adhesion to a wide range of substrates, including glass, aluminum, stainless steel, and common engineered plastics such as polycarbonate.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller EA6042 is a high-performance, fluorescence, fast UV-cure adhesive and encapsulant. This product has a tack-free surface finish and good electrical insulation performance. It has excellent precision dispensing and jetting performance. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. It has excellent adhesion and is flexible.