H.B. Fuller FH8708T

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

Product Type1K (1 component) Adhesive, Edge Bond Material, Reactive Adhesive

Application AreaElectronic Components, Printed Circuit Boards

Chemical FamilyEpoxides, Epoxy & Epoxy Derivatives

FeaturesFast Cure, High Glass Transition Temperature, High Reliability, Low Thermal Expansion

Technical Data Sheet

Enhanced TDS

Identification & Functionality

Features & Benefits

Features and Benefits
  • Low CTE
  • High Tg.
  • Fast cure at moderate temperature minimizing stress on components.
  • Repairable without damage to the attach pad

Applications & Uses

Cure Method
Preparation for Material Usage

1. Do not open the package before complete the thawing.
2. Thawing to room temperature (25°C) before using.
3. Could be repairable at 240 °C
4. Seal any remaining material and store immediately at 2-8°C, we do not recommend thawing material more than three times.

Clean-Up

Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.

Properties

Color
Physical Properties of Cured Material
ValueUnitsTest Method / Conditions
Hardness (cured at 100°C, 30min)80.0ASTM D-2240, Shore D
Elongation at Break (cured at 100°C, 30min)3.1%ASTM D-0412
Transition Temperature (cured at 100°C, 30min)163.0°C
Coefficient of Thermal Expansion (Alpha 1, cured at 100°C, 30min)24.0m/m.°CASTM E-831
Coefficient of Thermal Expansion (Aplha 2, cured at 100°C, 30min)117.0m/m.°CASTM E-831
Water Absorption (at 24 h, cured at 100°C, 30min)0.21%
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Strength16.3kV/mmASTM D-149
Surface Resistivity1.2 x 10¹⁶ohmASTM D-257
Volume Resistivity4.1 x 10¹⁶Ω.cmASTM D-257
Uncured Properties
ValueUnitsTest Method / Conditions
Viscosity (Brookfield CP52, 100 rpm, at 25°C)41280.0cP
Thixotropic Index4.22
Specific Gravity1.58
Working Pot Life3.0days

Technical Details & Test Data

Curing Profile
  • Recommended cure conditions:
    • 5 minutes @ 150℃
    • 10 minutes @ 130℃
    • 30 minutes @ 100℃

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America

Storage & Handling

Shelf Life
6 Months
Storage Conditions

FH8708T is supplied in 30ml/syringes
It should be stored in a 2-8°C refrigerator.
Shelf life is 6 months from date of manufacture.