H.B. Fuller FH8708T

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

Product Type: 1K (1 component) Adhesive, Edge Bond Material, Reactive Adhesive

Application Area: Electronic Components, Printed Circuit Boards

Chemical Family: Epoxides, Epoxy & Epoxy Derivatives

Features: Fast Cure, High Glass Transition Temperature, High Reliability, Low Thermal Expansion

Technical Data Sheet
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Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Features and Benefits
  • Low CTE
  • High Tg.
  • Fast cure at moderate temperature minimizing stress on components.
  • Repairable without damage to the attach pad

Applications & Uses

Application Area
Cure Method
Preparation for Material Usage

1. Do not open the package before complete the thawing.
2. Thawing to room temperature (25°C) before using.
3. Could be repairable at 240 °C
4. Seal any remaining material and store immediately at 2-8°C, we do not recommend thawing material more than three times.


Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.


Physical Properties of Cured Material
ValueUnitsTest Method / Conditions
Hardness (cured at 100°C, 30min)80.0-ASTM D-2240, Shore D
Elongation at Break (cured at 100°C, 30min)3.1%ASTM D-0412
Transition Temperature (cured at 100°C, 30min)163.0°C-
Coefficient of Thermal Expansion (Alpha 1, cured at 100°C, 30min)24.0m/m.°CASTM E-831
Coefficient of Thermal Expansion (Aplha 2, cured at 100°C, 30min)117.0m/m.°CASTM E-831
Water Absorption (at 24 h, cured at 100°C, 30min)0.21%-
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Strength16.3kV/mmASTM D-149
Surface Resistivity1.2 x 10¹⁶ohmASTM D-257
Volume Resistivity4.1 x 10¹⁶Ω.cmASTM D-257
Uncured Properties
ValueUnitsTest Method / Conditions
Viscosity (Brookfield CP52, 100 rpm, at 25°C)41280.0cP-
Thixotropic Index4.22--
Specific Gravity1.58--
Working Pot Life3.0days-

Technical Details & Test Data

Curing Profile
  • Recommended cure conditions:
    • 5 minutes @ 150℃
    • 10 minutes @ 130℃
    • 30 minutes @ 100℃

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America

Storage & Handling

Shelf Life
6 Months
Storage Conditions

FH8708T is supplied in 30ml/syringes
It should be stored in a 2-8°C refrigerator.
Shelf life is 6 months from date of manufacture.