Products

H.B. Fuller MP5405 is a two-part unfilled epoxy adhesive designed for ceramics and most plastics. It cures to a tough, semi-rigid material with a free-flowing viscosity. It has good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was especially formulated to have a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. Handling strength is normally achieved at room temperature within 3 - 5 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

Apollo Roofing RoofPrime Epoxy Metal Primer is an epoxy metal primer formulated with reactive chemistry epoxy. It is specifically designed to improve the adhesion of metals, making it perfect for complex details. This primer can be easily applied with a roller or brush, providing convenience and ease of use. It is primarily used for improving the adhesion properties of various metals, allowing for overlay with liquid roof coatings in liquid-applied membrane applications.

Foster® Cryogenic Adhesive 82-77 is a chemically curing adhesive with the capability to achieve high tensile strength and adhesion at room temperature. It effectively bonds to a range of surfaces, including metal, wood, and masonry. This adhesive is supplied in a virtually 100% solids form, facilitating immediate bonding for non-porous surfaces without the risk of solvent entrapment issues.

H.B. Fuller EX9801 is a two-component epoxy adhesive with reactive chemistry. It is known for its strong bonding strength, excellent water resistance, and corrosion resistance properties. This adhesive is commonly used for bonding composite materials, assembling wood angles, and in the manufacturing of window frames and fenestration products.

H.B. Fuller 48173/58173 is an extra-fast setting, two-component, room temperature-curing epoxy adhesive. This system will cure at as low as -18°C (0°F). It has a convenient mix ratio, excellent cohesive strength, and bonds to most substrates, including concrete, ceramics, metals, carbon steel, stainless steel, aluminum, plastics, epoxy, stone, wood, glass, china, and leather. It is recommended for fast patching, fixturing, and other repairs requiring quick handling strength. Two slower-setting versions of this system are also available, which include 58185, which sets in approximately 10 minutes, and 58269, which sets in approximately 20 minutes. This extra-fast-setting epoxy is an excellent general-purpose adhesive. H.B. Fuller 48173/58173 is available in the unique DOUBLE/BUBBLE® job-sized package as Reorder No. 04001.

H.B. Fuller MP5405NS is a two-part unfilled epoxy adhesive that is designed for high-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid material and has a thixotropic paste consistency to prevent running and sagging. This product has good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was specially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 20 - 30 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

H.B. Fuller FH8515 is a 2K epoxy adhesives. It offers excellent impact strength and toughness, making it suitable for bonding a wide range of materials. The adhesive is flammable retardant (UL 94 V0) and halogen-free, ensuring safety and compliance with regulations. It is commonly used for structure bonding applications, particularly in the assembly of portable devices. H.B. Fuller FH8515 provides reliable and durable bonding for various components in portable devices, contributing to their overall strength and performance.

H.B. Fuller FH8623 is an epoxy adhesive. This adhesive is known for its high-performance characteristics, making it suitable for demanding applications. One of the notable features and benefits of H.B. Fuller FH8623 is its ultra-fast curing property. Additionally, H.B. Fuller FH8623 offers high toughness, providing excellent strength and durability to bonded structures. H.B. Fuller FH8623 is primarily used for structure bonding in module applications.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

Tonsan® TS832 is a 2K liquid-reactive adhesive with a range of valuable features. This ready-to-use product is known for its excellent toughness, heat resistance, high strength, high-temperature resistance, and low viscosity. It ensures even stress distribution on the joint surface, causing no heat impact or deformation of components. With its fast curing speed, it enhances operational efficiency and is widely employed for bonding different materials.

H.B. Fuller FH8512 is a 2K epoxy adhesive. This adhesive offers a balance of features and benefits that make it suitable for a wide range of applications, including structure bonding in portable devices. One of the notable characteristics of the H.B. Fuller FH8512 is its medium fixture time.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller FH8621 is a one-component, low-temperature-curing epoxy adhesive. It features fast curing at a low temperature, low shrinkage, high adhesive strength, and adhesion to a variety of substrates. FH8621 will cure faster with an increased temperature. Additionally, it offers high and low temperature resistance.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller FH1425 is a two-part epoxy adhesive specifically formulated for encapsulating and protecting electronics in challenging environments. This epoxy system offers flexibility, making it suitable for applications where the electronics require a high level of protection. Its primary use is for the protection of electronics, including electric motors, where a highly flexible epoxy resin system is required.