H.B. Fuller MP5430NS

H.B. Fuller MP5430NS is a two-part modified epoxy adhesive designed for medium-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid polymer and is delivered in a non-sagging viscosity. It provides good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was specially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 40 - 50 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

Chemical FamilyEpoxy & Epoxy Derivatives

Product Type2K (2 component) Adhesive, Epoxy Adhesive, Reactive Adhesive, Structural Adhesive

Compatible Substrates & SurfacesCeramic, Metal, Plastics

FeaturesElectrical Insulation Properties, Excellent Salt Spray Resistance, Free Flowing, Good Adhesion, Good Sagging Resistance, Good Toughness, Room Temperature Curing, Solvent Resistance, Water Resistant

Technical Data Sheet

Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
General Instructions
  • Surfaces to be bonded must be clean, dry and free of other contaminants.
  • Bring both components to room temperature prior to mixing.
  • Measure out specified amounts of parts A and B and stir (without introducing bubbles) until homogenous or use a static mixing nozzle.
  • Apply the uniform mixture to both surfaces.
  • Allow to cure while being held in place with light clamping.


Physical Form
Clear liquid
Component A
ValueUnitsTest Method / Conditions
Component B
ValueUnitsTest Method / Conditions
Cured Properties
ValueUnitsTest Method / Conditions
Hardness78 - 80ASTM D2240
Tensile Strength48.3MPaASTM D638
Elongation at Break3 - 5%ASTM D638
Overlap Shear Strength (Aluminum, acid etched at 25°C, at 50% RH)min. 1500psiASTM D1002
Operating Temperature- 40 - 130°C
Dielectric Constant (at 100Hz)4.5ASTM D150
Dielectric Strength16.1kV/mmASTM D149
Uncured Properties
ValueUnitsTest Method / Conditions
Specific Gravity (Part A)1.11
Specific Gravity (Part B)1.15
Specific Gravity (Mix)1.13
Volume Mix Ratio1:1
Weight Mix Ratio1:1
Pot Life (20 gram)20 - 25min
Full Cure (at 23°C)40 - 50min
Full Cure (at 66°C)24.0h
Rheological Properties
ValueUnitsTest Method / Conditions
Viscosity (Mixed)Paste

Packaging & Availability

Regional Availability
  • Latin America
  • North America
Storage Conditions
  • Product should be stored in a cool and dry place out of direct sunlight.
  • The shelf life is from date of manufacture.
  • Shelf life is based on the products being stored properly at temperatures between 12°C and 25°C.
  • Exposure to temperatures above 25°C will reduce the shelf life.
  • This product should not be frozen.

Storage & Handling

Shelf Life
12 Months