Products

Tonsan® EP832 is an epoxy adhesive known for its high strength, good toughness, and heat resistance up to 150°C in the long term and 180°C in the short term. With its low viscosity, it is suitable for potting bonding and exhibits excellent bonding performance to metal, stone, wood, ceramic, and most plastics. This adhesive is commonly used in the electric vehicle industry.

H.B. Fuller MP5430NS is a two-part modified epoxy adhesive designed for medium-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid polymer and is delivered in a non-sagging viscosity. It provides good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was specially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 40 - 50 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

H.B. Fuller FH8511 is a 2K epoxy adhesive known for its excellent impact strength and toughness. It is a versatile adhesive suitable for bonding a wide range of materials commonly found in portable devices. The adhesive offers fast setting properties, allowing for efficient assembly and production processes. The adhesive is formulated for structure bonding applications, providing strong and durable connections between components. H.B. Fuller FH8511 is commonly used in the manufacturing of portable devices where structural bonding is critical for their performance and durability.

H.B. Fuller EY2562 is designed to fill the need for a strong, pourable, and lightweight filler for honeycomb core panels. It can be used to pot fasteners or as an edge closeout after the panel is trimmed to contour. It is fire retardant, resistant to long exposure to 350°F, and cures at room temperature in thicknesses in excess of one inch.

H.B. Fuller EY3010 is a two-part, thixotropic epoxy compound. It is designed for use with Shur-Lok fasteners to achieve high strength and dependable bonded inserts in honeycomb panels. The handling properties of these products are similar. However, the H.B. Fuller EY3010 is designed for the lowest weight. It is available within NASA limits because it has the low volatile content required for space applications. H.B. Fuller EY3010 A/B is qualified for LAC 30-8036A.

H.B. Fuller FH6501 is a one-part epoxy adhesive specifically designed for potting and bonding electronic components. It is a heat-curable epoxy that offers excellent thermal conductivity. This product is commonly used in applications requiring thermally conductive properties, such as in electric motors.

Double Bubble Epoxy Extra Fast Setting is a two-component, room temperature curing epoxy adhesive with an extra-fast setting time. It cures at temperatures as low as –18°C (0°F) and has a convenient mix ratio. Known for its excellent cohesive strength, it bonds to various substrates including metal, wood, concrete, ceramics, and many plastics. Ideal for fast patching, fixturing, and repairs requiring quick handling strength, it serves as an excellent general-purpose adhesive.

H.B. Fuller FH8512 is a 2K epoxy adhesive. This adhesive offers a balance of features and benefits that make it suitable for a wide range of applications, including structure bonding in portable devices. One of the notable characteristics of the H.B. Fuller FH8512 is its medium fixture time.

H.B. Fuller EY2536 is a very lightweight, easily spread epoxy compound for edge filling sandwich panels used in aircraft interiors. It wipes in cleanly and can be sanded smooth after an overnight cure at room temperature. H.B. Fuller EY2536 is self-extinguishing when tested per FAR 25.853, Appendix F.

H.B. Fuller MP54110 is a two-part unfilled epoxy adhesive designed for bonding of metals, ceramics, and most plastics. This product gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. This product has better water and temperature resistance than standard 5-minute epoxy. It was specially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 30 - 60 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

Körapox BS 85 is an epoxy adhesive with reactive chemistry. It creates an anti-slip surface and offers good abrasion resistance and UV resistance. It is commonly used in floor coatings, such as in refrigerated vehicles, specialty vehicles, busses, trucks, and commercial vehicles.

Resiweld FE 7258 A / FE 7258 B are liquid-reactive 2K epoxy adhesives. It is specifically designed for bonding glass fiber to the outer wrapping of reverse osmosis filters. This epoxy adhesive offers a low viscosity and is odorless, providing a convenient and efficient bonding solution. It is commonly used for applications such as spiral wound filters and membrane separation.

H.B. Fuller FH8513 is a 2K epoxy adhesive developed for structure bonding in portable devices. One notable advantage of FH8513 is its design for device assembly. It is formulated to provide reliable and durable bonds when joining various components in portable devices. It also offers a long open time, which refers to the duration during which the adhesive remains workable after mixing its two components. In addition, H.B. Fuller FH8513 exhibits high toughness, meaning it can withstand mechanical stresses and impacts without compromising the bond strength.

H.B. Fuller MP5405NS is a two-part unfilled epoxy adhesive that is designed for high-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid material and has a thixotropic paste consistency to prevent running and sagging. This product has good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was specially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 20 - 30 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

H.B. Fuller FH8050 is an electrically insulating, one-component epoxy encapsulant and bonding material. It is specifically designed to cure during lead-free solder reflow while allowing self-alignment of IC components. This corner bonding material improves the mechanical reliability of hand-held devices.