H.B. Fuller EA6402M

H.B. Fuller EA6402M is a one-component adhesive that can be cured by both UV and thermal methods. This adhesive has a fast curing time at 80℃, and also features low shrinkage, high adhesive strength, and the ability to adhere to a variety of substrates.

Product Type: 1K (1 component) Adhesive, Epoxy Adhesive, Radiation Curable Adhesive

Application Area: Charged Coupled Device (CCD) , Complementary Metal Oxide Semiconductor (CMOS), Electronic Components

Chemical Family: Epoxy & Epoxy Derivatives

Features: Excellent Substrate Adhesion, Fast Curing, Low Shrinkage, UV Curable

Technical Data Sheet

Enhanced TDS

Identification & Functionality

Features & Benefits

Features and Benefits
  • One component; no mixing required
  • Fast cure at 80°C or 3000mj ultraviolet light
  • Use for CCD/CMOS adhesion
  • Dual curing process

Applications & Uses

Cure Method

Equipment and any spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.

Directions for Use

1. Prior to bonding, substrate surface must be free of any dust, oils, or other contaminants.
2. Bring material to room temperature (25°C) before using (typical thaw time for 10ml syringes is 2-4 hours). We do not recommend thawing the material more than 3 times.
3. EA6402M is sensitive to humidity; do not expose the material to air for an extended period of time. The recommended relative humidity during dispensing is <60%.
4. If the material is left idle in the syringe tip for an extended period of time, the tip should be purged or solvent cleaned.
5. Seal any remaining material and store immediately at -18°C.


Physical Properties
ValueUnitsTest Method / Conditions
Shear Strength14.0MPa-
Glass Transition Temperature33.0°C-
Coefficient of Thermal Expansion (Alpha 1)48.0ppm/°C-
Coefficient of Thermal Expansion (Aplha 2)178.0ppm/°C-
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Strength26.3kV/mm-
Dielectric Loss (at 1kHZ)3.2/0.02--
Dielectric Loss (at 100kHZ)3.3/0.03--
Volume Resistivity5.2× 1015Ω.cm-
Surface Resistivity1.9 x 10¹⁶ohm-
Uncured Properties
ValueUnitsTest Method / Conditions
Thixotropic Index3.1--
Work Life (max. 60% RH)3.0days-

Technical Details & Test Data

Cure Schedule
  • UV cure schedule: 3200mj +
  • Thermal cure schedule:
    • 30 minutes at 80°C

EA6402M will cure faster with temperature increasing. The curing temperature and curing time should be adjusted according to the heating device and the material to be bonded.

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America

Storage & Handling

Shelf Life
6 Months
Storage Conditions

EA6402M should be stored at -18°C.
Shelf life is a 6 months from date of manufacture, in original unopened containers.