Products

ProSpec® Slab Dowel Grout is a non-shrink, high compressive strength grout, non-metallic, ideal for placing prefabricated concrete pavements and structural grouting applications.

H.B. Fuller EA6402M is a one-component adhesive that can be cured by both UV and thermal methods. This adhesive has a fast curing time at 80℃, and also features low shrinkage, high adhesive strength, and the ability to adhere to a variety of substrates.

Childers® Chil-Joint® CP-70 Sealant is a cost-effective joint sealant designed for use in various insulation systems, including low-temperature, dual-temperature, and some high-temperature applications. This sealant is non-shrinking and non-drying, ensuring long-lasting performance. It is also available in caulking tubes for application with hand or power caulking guns.

Childers® Chil-Byl® CP-76 Sealant is a well-balanced mixture of butyl polymers tailored for long-lasting flexibility in various insulation applications, including low-temperature, dual-temperature, and high-temperature settings. It is an excellent water seal, vapor seal, and expansion joint material and is suggested as a joint sealant for metal jacketing systems.

H.B. Fuller FH8623 is an epoxy adhesive. This adhesive is known for its high-performance characteristics, making it suitable for demanding applications. One of the notable features and benefits of H.B. Fuller FH8623 is its ultra-fast curing property. Additionally, H.B. Fuller FH8623 offers high toughness, providing excellent strength and durability to bonded structures. H.B. Fuller FH8623 is primarily used for structure bonding in module applications.

H.B. Fuller EA6405 is a one-component adhesive that can be cured by UV irradiation followed by thermal cure. It has fast UV curing and low-temperature heat curing with outstanding bond strength to PC substrates. This material is designed for structural bonding and has superior adhesion to a wide range of substrates, including plastics and metals such as PC, PMMA, aluminum, stainless steel, and other polar substrates.

H.B. Fuller FH8633 is a one-component, thermal-curable adhesive with fast curing at low temperatures, low shrinkage, and high adhesive strength. It can adhere to a variety of substrates and has excellent thermal performance, making it suitable for high-temperature applications. This material also provides high bond strength on various substrates.

H.B. Fuller FH8621 is a one-component, low-temperature-curing epoxy adhesive. It features fast curing at a low temperature, low shrinkage, high adhesive strength, and adhesion to a variety of substrates. FH8621 will cure faster with an increased temperature. Additionally, it offers high and low temperature resistance.

Swift®col 5237 is a solvent-borne acrylic self-curing pressure-sensitive adhesive with very high cohesion performance, good plasticizer resistance, and low shrinkage. It provides superior characteristics compared to traditional solvent-based adhesives, delivering excellent performance for coated products.

H.B. Fuller FH8620 is a one-component, low-temperature curing epoxy adhesive. This material features fast curing at low temperatures, low shrinkage, high adhesive strength, and adhesion to a variety of substrates. FH8620 will cure faster at an increased temperature. It also exhibits high and low temperature resistance.

H.B. Fuller FH8626 is a one-component, low-temperature-curing epoxy adhesive. This material features fast curing at low temperatures, low shrinkage, high adhesive strength, and adhesion to a variety of substrates. FH8626 will cure faster with increased temperature and has a low modulus to prevent warpage.