H.B. Fuller FH8626

H.B. Fuller FH8626 is a one-component, low-temperature-curing epoxy adhesive. This material features fast curing at low temperatures, low shrinkage, high adhesive strength, and adhesion to a variety of substrates. FH8626 will cure faster with increased temperature and has a low modulus to prevent warpage.

Product Type1K (1 component) Adhesive, Reactive Adhesive

Chemical FamilyEpoxy & Epoxy Derivatives

FeaturesElectrically Non Conductive, Fast Cure, Fungus Resistant, Good Adhesion, High Temperature Resistance, Low Shrinkage, Low Temperature Curing, Low Temperature Resistant, Low Warpage

Technical Data Sheet

Enhanced TDS

Identification & Functionality

Features & Benefits

Features and Benefits
  • One component; no mixing required
  • Fast cure at 75°C
  • Low modulus to prevent warpage
  • Non-conductive; non-corrosive
  • Halogen free; REACH and Rohs compliant
  • High and low temperature resistance
  • Fungus-resistance (does not support growth)

Applications & Uses

Directions for Use

1. Prior to bonding, surfaces must be free of any dust, oils, or other contaminants.
2. Bring material to room temperature (25°C) before using (typical thaw time for 50mL syringes is 2-4 hours). We do not recommend thawing the material more than 3 times.
3. FH8626 is sensitive to humidity; do not expose the material to air for an extended period of time. The recommended relative humidity during dispensing is <60%.
4. If the material is left idle in the syringe tip for an extended period of time, the tip should be purged or solvent cleaned.
5. Seal any remaining material and store immediately at -18°C.


Equipment and any spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.


Physical Properties of Cured Material
ValueUnitsTest Method / Conditions
Hardness (cured 20 min, at 80°C)82.0Shore D
Elongation at Break (cured 20 min, at 80°C)1.8%
Shear Strength (cured 20 min, at 80°C)23.0MPa
Glass Transition Temperature (cured 20 min, at 80°C)38.7°C
Coefficient of Thermal Expansion (Alpha 1, cured 20 min, at 80°C)71.0m/m.°C
Coefficient of Thermal Expansion (Aplha 2, cured 20 min, at 80°C)212.9m/m.°C
Water Absorption (after 24 h, cured 20 min, at 80°C))0.12%
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Strength27.3kV/mm
Dielectric Constant (at 1KHz)3.1/0.02
Dielectric Loss (at 100kHZ)3.2/0.03
Volume Resistivity5.6 x 10¹⁵Ω.cm
Surface Resistivity1.9 x 10¹⁶ohm
Uncured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.19
Thixotropic Index4.1
Work Life (max. 60% RH)9.0days
Typical Cured Properties
ValueUnitsTest Method / Conditions
Pot Life3.0days

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedule
  • Cure schedule:
    • 3-5 minutes at 80°C
    • 15 minutes at 75°C
  • FH8626 will cure faster with increased temperature. The curing temperature and curing time should be adjusted according to the heating device and the material to be bonded.

Storage & Handling

Shelf Life
6 Months
Storage Conditions

FH8626 should be stored at -18°C.
Shelf life is a 6 months from date of manufacture, in original unopened containers.