Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Features and Benefits
- One component; no mixing required
- Fast cure at 75°C
- Low modulus to prevent warpage
- Non-conductive; non-corrosive
- Halogen free; REACH and Rohs compliant
- High and low temperature resistance
- Fungus-resistance (does not support growth)
Applications & Uses
- Markets
- Directions for Use
1. Prior to bonding, surfaces must be free of any dust, oils, or other contaminants.
2. Bring material to room temperature (25°C) before using (typical thaw time for 50mL syringes is 2-4 hours). We do not recommend thawing the material more than 3 times.
3. FH8626 is sensitive to humidity; do not expose the material to air for an extended period of time. The recommended relative humidity during dispensing is <60%.
4. If the material is left idle in the syringe tip for an extended period of time, the tip should be purged or solvent cleaned.
5. Seal any remaining material and store immediately at -18°C.- Clean-Up
Equipment and any spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.
Properties
- Physical Properties of Cured Material
- Electrical Properties
- Uncured Properties
- Typical Cured Properties
| Value | Units | Test Method / Conditions | |
| Hardness (cured 20 min, at 80°C) | 82.0 | - | Shore D |
| Elongation at Break (cured 20 min, at 80°C) | 1.8 | % | - |
| Shear Strength (cured 20 min, at 80°C) | 23.0 | MPa | - |
| Glass Transition Temperature (cured 20 min, at 80°C) | 38.7 | °C | - |
| Coefficient of Thermal Expansion (Alpha 1, cured 20 min, at 80°C) | 71.0 | m/m.°C | - |
| Coefficient of Thermal Expansion (Aplha 2, cured 20 min, at 80°C) | 212.9 | m/m.°C | - |
| Water Absorption (after 24 h, cured 20 min, at 80°C)) | 0.12 | % | - |
| Value | Units | Test Method / Conditions | |
| Dielectric Strength | 27.3 | kV/mm | - |
| Dielectric Constant (at 1KHz) | 3.1/0.02 | - | - |
| Dielectric Loss (at 100kHZ) | 3.2/0.03 | - | - |
| Volume Resistivity | 5.6 x 10¹⁵ | Ω.cm | - |
| Surface Resistivity | 1.9 x 10¹⁶ | ohm | - |
| Value | Units | Test Method / Conditions | |
| Specific Gravity | 1.19 | - | - |
| Viscosity | 11910.0 | cP | - |
| Thixotropic Index | 4.1 | - | - |
| Work Life (max. 60% RH) | 9.0 | days | - |
| Value | Units | Test Method / Conditions | |
| Pot Life | 3.0 | days | - |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedule
- Cure schedule:
- 3-5 minutes at 80°C
- 15 minutes at 75°C
- FH8626 will cure faster with increased temperature. The curing temperature and curing time should be adjusted according to the heating device and the material to be bonded.
- Cure schedule:
Storage & Handling
- Shelf Life
- 6 Months
- Storage Conditions
FH8626 should be stored at -18°C.
Shelf life is a 6 months from date of manufacture, in original unopened containers.