Products

H.B. Fuller EV Therm 601 is a one-component UV curable technology that is thermally conductive, flame retardant, and electrically insulative. This material provides an optimum coating with a minimum coating thickness of 150 microns and encapsulation protection for electronic assemblies and components. This material was designed to be thermally conductive and is recommended for use with heatsinks, heat spreaders, cold plates, cooling tubes, and other thermal dissipation applications.

H.B. Fuller UV890SF-150D is a 1-part UV-curable conformal coating adhesive. It is a single-component adhesive with low viscosity and solvent-free properties. It can be applied using a brush, dip, or spray method. It is commonly used to protect printed circuit boards (PCBs) in various high-reliability applications, making it an ideal conformal coating material for electronic components, including electric motors.

H.B. Fuller EV Protect 5006 offers battery designers the ability to integrate high-level structural performance characteristics into their battery system, which is ideal for cell to pack applications. This ultra-lightweight material minimizes weight addition to the battery pack and, when exposed to a thermal event, significantly reduces or delays thermal propagation. With a reduced viscosity and improved curing speed, the EV Protect 5006 is especially advantageous for those with unique, complex, or intricate battery design architecture. Works in all types of battery cell form factors (cylindrical, prismatic, or pouch).

FLEXOBOND 442 BLACK is a thermally conductive polyurethane adhesive with low outgassing properties. It is specifically designed for bonding glass diodes or other stress-sensitive components. This adhesive offers excellent electrical properties and high flexibility. It is well-suited for circuit board assembly and protection in space exploration applications.

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller EA6053H is a fast-curing adhesive that utilizes UV light to cure. The product possesses a soft and flexible nature, while also exhibiting excellent adhesion properties. This adhesive can be used as a replacement for silicone rings in buffering applications. It is capable of providing good adhesion to a variety of substrates, including glass, plastics, and metals.

H.B. Fuller EV Bond 383 is a thixotropic, toughened, two-component, ambient-curing epoxy adhesive. High impact resistance, moderate cure speeds, and good peel resistance characteristics make this system suitable for assembly or sealing of reinforced composite structures, metal bonding, or other applications where a toughened epoxy adhesive is required. This system contains dyes that fluoresce brightly with exposure to UV inspection lamps (black light).

H.B. Fuller EV Bond 343 is a medium-hardness, semi-flexible two– component polyurethane adhesive designed for bonding applications requiring resilient bonds, non-sag application and enhanced adhesion to flexible substrates. EV Bond 343 is suitable for bonding metals, ceramics, natural rubber, thermosetting polymers and select types of unprepared thermoplastic substrates such as ABS, polycarbonate and nylon.

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.

H.B. Fuller EA6202 is a fast UV-cured adhesive with medium viscosity. It is a general-purpose, one-component adhesive with good gap flow. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6202 has shown excellent adhesion and is flexible.

H.B. Fuller EV Seal 200 is an MS polymer system that can be used for 1K moisture curing or a 2K accelerated cure option. Fast skin-over and green strength at room temperature. The product shows superb mechanical properties and provides unparalleled levels of sealing and resistance. Suitable for adhesion to a wide range of substrates like plastics, metals, and composite materials.

Q-Set™ 250-750 represents a two-part polyurethane composite backfill renowned for its waterproof properties. This innovative solution efficiently expands to occupy the peripheral void surrounding a satellite dish post within the hole. By creating a robust composite material, it provides substantial structural support to the post, ensuring its stability and upright positioning are maintained. This advanced polyurethane formulation not only offers water resistance but also contributes to the overall durability and longevity of satellite installations, making it a reliable choice for backfill applications.

Tonsan® EP832 is an epoxy adhesive known for its high strength, good toughness, and heat resistance up to 150°C in the long term and 180°C in the short term. With its low viscosity, it is suitable for potting bonding and exhibits excellent bonding performance to metal, stone, wood, ceramic, and most plastics. This adhesive is commonly used in the electric vehicle industry.

UR3543ABTF is a two-component, self-leveling viscosity polyurethane that cures at room temperature. This material is perfect for encapsulating, sealing, and protecting electronic assemblies and components. It offers excellent adhesion to a wide range of surfaces, including common metals and engineering plastics, making it a reliable choice for electronic applications.