H.B. Fuller FH8623

H.B. Fuller FH8623 is an epoxy adhesive. This adhesive is known for its high-performance characteristics, making it suitable for demanding applications. One of the notable features and benefits of H.B. Fuller FH8623 is its ultra-fast curing property. Additionally, H.B. Fuller FH8623 offers high toughness, providing excellent strength and durability to bonded structures. H.B. Fuller FH8623 is primarily used for structure bonding in module applications.

Product Type: Structural Adhesive

Application Area: Camera Applications, Electronic Components, Sensor Module

Chemical Family: Epoxy & Epoxy Derivatives

Features: Excellent Performance, Fast Curing, Good Toughness, Low Shrinkage, Low Temperature Curing

Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • North America