- Product Type:Structural Adhesive
- Application Area:Sensor Module, Electronic Components, Camera Applications
- Chemical Family:Epoxy & Epoxy Derivatives
- Features:Fast Curing, Excellent Performance, Low Shrinkage, Low Temperature Curing, Good Toughness
H.B. Fuller FH8623 is an epoxy adhesive. This adhesive is known for its high-performance characteristics, making it suitable for demanding applications. One of the notable features and benefits of H.B. Fuller FH8623 is its ultra-fast curing property. Additionally, H.B. Fuller FH8623 offers high toughness, providing excellent strength and durability to bonded structures. H.B. Fuller FH8623 is primarily used for structure bonding in module applications.