Products

H.B. Fuller MP54110 is a two-part unfilled epoxy adhesive designed for bonding of metals, ceramics, and most plastics. This product gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. This product has better water and temperature resistance than standard 5-minute epoxy. It was specially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 30 - 60 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

H.B. Fuller EV Protect 300 is a two-component, low viscosity polyurethane encapsulating system that is designed for potting and encapsulating of battery cells in battery modules. This product offers battery designers the ability to enhance safety and protection from thermal propagation.

H.B. Fuller TS880 is a two-part adhesive (10:1 ratio by volume), which can bond many low-surface-energy plastics without special surface preparation, including many grades of polypropylene, polyethylene, TPO, etc. TS880 can replace screws, rivets, plastic welding, and two-step processes that include chemical etchants, priming, or surface treatments in many applications. Typical applications include bonding plastics, metals, glass, and rubbers.

H.B. Fuller EY3010 is a two-part, thixotropic epoxy compound. It is designed for use with Shur-Lok fasteners to achieve high strength and dependable bonded inserts in honeycomb panels. The handling properties of these products are similar. However, the H.B. Fuller EY3010 is designed for the lowest weight. It is available within NASA limits because it has the low volatile content required for space applications. H.B. Fuller EY3010 A/B is qualified for LAC 30-8036A.

MP-58420 is a two-part methacrylated acrylic hybrid adhesive designed for non-flammable, low-odor applications. It bonds plastics, metals, and composites, providing strong durability, impact resistance, flexibility, and weathering properties across temperature fluctuations and chemical exposure.

MP-55305 is a high-performance, two-part methacrylate adhesive engineered to bond a wide range of plastics, metals, and composite assemblies. It offers outstanding bond strength, is extremely durable, and has excellent impact and weathering properties. H.B. Fuller MP55305 greatly increases the reliability of finished assemblies with its exceptional flexibility, ability to withstand extreme temperature fluctuations and thermal cycling, and resistance to a wide range of chemicals and environmental conditions. It offers exceptional bonding for a wide range of substrates.

MP-55300 is a high-performance, two-part methacrylate adhesive engineered to bond a wide range of plastics, metals, and composite assemblies. It offers outstanding bond strength, is extremely durable, and has excellent impact and weathering properties. H.B. Fuller MP55300 greatly increases the reliability of finished assemblies with its exceptional flexibility, ability to withstand extreme temperature fluctuations and thermal cycling, and resistance to a wide range of chemicals and environmental conditions. It offers exceptional bonding for a wide range of substrates.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller FH8017M is a black-colored epoxy-based underfill adhesive specifically designed for electronic components, including printed circuit boards (PCBs) and batteries. This ready-to-use product offers excellent flow properties, ensuring smooth and precise application. It provides good bonding strength, resulting in reliable and secure adhesion.

Tonsan® AT 2641 is a 2K PU structural adhesive designed for composite materials bonding. It cures at room temperature or can be accelerated with heating, resulting in excellent adhesion, impact resistance, water resistance, electrical isolation, and corrosion resistance upon curing.

H.B. Fuller 46580/56580 is a thixotropic, extra-fast-setting, two-component epoxy adhesive. It has a convenient mix ratio, excellent sag resistance when applied to vertical surfaces, and a smooth paste consistency. It is recommended for rapid repairs and electrical and industrial staking. H.B. Fuller 46580/56580 extra-fast setting epoxy is an excellent general-purpose adhesive. It is recommended for substrates such as metals, carbon steel, stainless steel, aluminum, plastics, epoxy, stone, wood, glass, china, and leather. H.B. Fuller 46580/56580 is available in the unique DOUBLE-BUBBLE® job-sized package as Reorder No. 04008.

Tonsan® EP843 is an epoxy adhesive known for its high strength and heat resistance, capable of withstanding temperatures up to 150°C in the long term and 180°C in the short term. It has a high viscosity, making it suitable for potting bonding applications where thixotropic properties are desired, preventing flow on vertical surfaces. This adhesive is specifically designed for bonding metal and other parts in high-temperature and harsh conditions, making it ideal for use in the electric vehicle industry.

H.B. Fuller PHOTOCAP® 15585P is an ultrafast-curing, PID-resistant EVA (ethylene vinyl acetate copolymer) photovoltaic encapsulating film with HLT™ higher light transmission in the UV wavelength region to allow greater power generation with blue light-sensitive photovoltaic devices. It has a short lamination cycle, excellent light transmission, and outstanding stability in the field.

H.B. Fuller AT-3 very high-bond strength acrylic tape is a pressure-sensitive, structural-grade, solid acrylic tape system. It is designed to provide a superior bond between a wide variety of substrates. The tape possesses a uniform, high-tack acrylic adhesive on both surfaces with an integral core of solid acrylic polymer that will bond to most clean, dry, oil-free substrates.