Products

Tonsan® EP832 is an epoxy adhesive known for its high strength, good toughness, and heat resistance up to 150°C in the long term and 180°C in the short term. With its low viscosity, it is suitable for potting bonding and exhibits excellent bonding performance to metal, stone, wood, ceramic, and most plastics. This adhesive is commonly used in the electric vehicle industry.

H.B. Fuller PHOTOCAP® 15580P is an ultrafast-curing, PID-resistant EVA (ethylene vinyl acetate copolymer) photovoltaic encapsulating film designed for use in all photovoltaic devices. This product exhibits a short lamination cycle, excellent light transmission, along with outstanding stability in the field.

Millennium PG-1 Pump Grade (Low Viscosity Insulation) Adhesive is a two-component, essentially VOC-free, all-purpose, low-rise, polyurethane foamable adhesive that contains no solvents and sets in minutes. The application process is quick and easy, resulting in significant labor savings for the contractor. Millennium PG-1 Pump Grade Adhesive is dispensed through the Patented Millennium Cyclone Low Pressure Pump Cart* (by Garlock) or an approved low pressure pump cart that equally mixes Part 1 and Part 2 of the adhesive, providing a quality, consistent application each time.

H.B. Fuller MP5430NS is a two-part modified epoxy adhesive designed for medium-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid polymer and is delivered in a non-sagging viscosity. It provides good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was specially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 40 - 50 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

H.B. Fuller TL0600 A/B is a 2K urethane with an amber color and high viscosity. H.B. Fuller TL0600 A/B is commonly used for potting filters and applications where the adhesive is exposed to blood. Its uses also include filter potting.

H.B. Fuller EV Protect 5006 offers battery designers the ability to integrate high-level structural performance characteristics into their battery system, which is ideal for cell to pack applications. This ultra-lightweight material minimizes weight addition to the battery pack and, when exposed to a thermal event, significantly reduces or delays thermal propagation. With a reduced viscosity and improved curing speed, the EV Protect 5006 is especially advantageous for those with unique, complex, or intricate battery design architecture. Works in all types of battery cell form factors (cylindrical, prismatic, or pouch).

H.B. Fuller EV Protect 5008HD is an encapsulant, designed for electrical and electronics applications, specifically for parts and components in batteries and electric vehicles (EVs).

H.B. Fuller EV Therm 441 is a modified, highly engineered Structural Acrylic Adhesive designed to provide excellent thermal conductivity while maintaining superior strength and performance properties across a wide range of temperatures and substrates. H.B. Fuller EV Therm 441 is an excellent flame retardant with a UL94 V0 rating.

H.B. Fuller FH8511 is a 2K epoxy adhesive known for its excellent impact strength and toughness. It is a versatile adhesive suitable for bonding a wide range of materials commonly found in portable devices. The adhesive offers fast setting properties, allowing for efficient assembly and production processes. The adhesive is formulated for structure bonding applications, providing strong and durable connections between components. H.B. Fuller FH8511 is commonly used in the manufacturing of portable devices where structural bonding is critical for their performance and durability.

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.

H.B. Fuller EY2562 is designed to fill the need for a strong, pourable, and lightweight filler for honeycomb core panels. It can be used to pot fasteners or as an edge closeout after the panel is trimmed to contour. It is fire retardant, resistant to long exposure to 350°F, and cures at room temperature in thicknesses in excess of one inch.

Millennium One Step Green® Foamable Adhesive is an exciting, new, patented*, essentially VOC-free, all-weather insulation adhesive manufactured with an industry-leading 45%** rapidly renewable material content. Millennium One Step Green® Foamable Adhesive carries all of the equivalent FM approvals of our highly popular One Step Foamable Adhesive® and is designed for use with our One StepTM application process. Our One Step™ application process eliminates errors due to poor mixing. The application process is quick and easy, resulting in significant labor savings for the contractor. No expensive, high-maintenance specialty pumps or spray rigs are required.

Foster® Bridging Mastic Encapsulant-Lockdown 32-80™ is a dual-purpose coating designed for asbestos abatement. It is field-proven and, upon curing, forms a tough, light-colored, washable, abrasion-resistant elastomeric coating. This coating effectively reduces the release of asbestos fibers from both conventional and spray-applied asbestos-containing materials (ACM). When used with glass cloth, Foster® Bridging Mastic Encapsulant-Lockdown 32-80™ is ideal for covering interior pipe insulation and boiler lagging.

H.B. Fuller FH8623 is an epoxy adhesive. This adhesive is known for its high-performance characteristics, making it suitable for demanding applications. One of the notable features and benefits of H.B. Fuller FH8623 is its ultra-fast curing property. Additionally, H.B. Fuller FH8623 offers high toughness, providing excellent strength and durability to bonded structures. H.B. Fuller FH8623 is primarily used for structure bonding in module applications.