Products

H.B. Fuller 42TL is a thixotropic, anaerobic, blue threadlocker adhesive. It is formulated to cure rapidly and reliably on most "as received" fasteners. It gives predictable lubricity on assembly and is suitable for applications where disassembly with hand tools is required. It also prevents fasteners from loosening. Its typical applications include locking and sealing hydraulic line fittings, vacuum cleaner bell housing screws, hydraulic piston nuts, rocker nuts, oil pressure switch assembly, construction equipment bolts, bulldozer track bolts, railroad bolts on wear plates, carburetor adjusting screws, and machinery keys.

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller FH6501 is a one-part epoxy adhesive specifically designed for potting and bonding electronic components. It is a heat-curable epoxy that offers excellent thermal conductivity. This product is commonly used in applications requiring thermally conductive properties, such as in electric motors.

Tonsan® 1321FS is a high-performance epoxy structural adhesive. It is a one-part, heat-resistant epoxy adhesive known for its exceptional properties, including super-high shear strength, high thixotropy, high T-peel strength, and low shrinkage. This adhesive is suitable for demanding applications that require strong bonds and can be used to bond a variety of materials, including magnetic steel, metal, stone, wood, ceramics, and more.

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

Flexel™ FN1000 is a reactive, low-temperature heat-activated adhesive film for bonding similar and dissimilar plastic substrates like ABS, PC, PBT, pre-treated olefins (low surface energy plastics), Polyamide, Polyimide, engineering plastics, SMC, FRP, GRP, and advanced composites. FN1000 is also very effective at bonding PET films, textiles, and artificial and genuine leather.

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.

H.B. Fuller® PD-8271-X is an advanced adhesive known for its ready-to-use application and strong bonding properties. It is compatible with various substrates, providing versatility in multiple industries.

H.B. Fuller 1956 is a high-quality, multi-purpose, sag-resistant, one-component polyurethane sealant. This material is condensation-cure material. It has high strength and vibration-damping properties. It is used for automobile manufacturing, the shipping industry, container manufacture, heating and ventilation systems, and a variety of maintenance and repair applications.

H.B. Fuller 7148-3 is an EVA thermoset sealer that can be die-cut and has excellent adhesion to many metal substrates after undergoing a bake cycle. It is used in automotive OEM applications to seal plugs or drain holes on metal products.

H.B. Fuller WC2309 is a one-component heat-cure epoxy adhesive that belongs to the epoxy and epoxy derivatives chemical family. It offers excellent bonding strength, making it suitable for structural bonding of aluminum body structures. This ready-to-use product falls under the category of 1K liquid reactive adhesives and epoxy adhesives. It can be cured through heat.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

H.B. Fuller TS365 Marine Chocking Compound is a two-part epoxy mixture with good pouring performance. After curing, it has a high compressive strength and compressive modulus of elasticity, as well as excellent heat resistance, impact resistance, and self-extinguishing from fire. TS365 can be applied for positioning during assembly of various marine equipment, such as the main diesel engine, auxiliary machinery, stern tube, deck machinery, etc.

H.B. Fuller FH8801C is a fast-curing, single-component, electrically conductive adhesive designed for chip bonding in microelectronic, MEMS, and opto-electronic applications. This heat-curable material offers outstanding bond strength and snap cure during in-line production, making it ideal for automated assembly processes.

H.B. Fuller 80RC is a fast-curing, high-strength anaerobic adhesive. It is used for locking and sealing threads and for retaining cylindrical parts. It allows for larger machining tolerances and is highly resistant to heat, corrosion,vibrations, water, gasses, oils, hydrocarbons, and many chemicals.