FH8028F

FH8028F is a single component, heat curable reworkable epoxy CSP/WLCSP underfill. It is designed for fast flow at room temperature while completely filling the gap under the chip. This material is easy to rework and possesses better adhesion and electrical properties.

RTU Product Type: 1K (1 component) Adhesive, Epoxy Adhesive, Underfill Adhesive

Application Area: Chip Scale Packaging (CSP), Wafer Level Chip Scale Package (WLCSP)

Features: Fast Cure, Good Adhesion, Good Electrical Properties, Reworkability

Technical Data Sheet
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Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Product Highlights
  • One component; no mixing required
  • Fluorescent
  • Fast cure at moderate temperatures
  • Reworkable without damage to attach pads
  • High reliability design for portable device

Applications & Uses

Properties

Cured Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (material cured 150°C/30min)125°C-
Coefficient of Thermal Expansion (α₁,material cured 150°C/30min)50ppm/°C-
Coefficient of Thermal Expansion (α₂, material cured 150°C/30min)185ppm/°C-
Storage Modulus (at 25°C, material cured 150°C/30min)3,000MPa-
Uncured Properties
ValueUnitsTest Method / Conditions
Viscosity (at 25°C, 50 rpm)350cPs-
Specific Gravity1.28--
Work Life (at 25°C)2days-
Specifications
ValueUnitsTest Method / Conditions
Storage Temperature-20°C-

Technical Details & Test Data

Recommended Cure
  • 150°C for 10 minutes
  • The curing temperature and curing time should be adjusted according to the heating device and the material to be bonded.

Packaging & Availability

Regional Availability
  • Global
Packaging Information

10cc, 30cc, and 55cc syringe

Storage & Handling

Shelf Life
6 months
Storage Conditions

FH8028F should be stored at -20°C. Shelf life is 6 months from date of manufacture, in original unopened containers.