H.B. Fuller MP5401

H.B. Fuller MP5401 is a one-component, heat-curable, thixotropic epoxy paste adhesive. It is a non-sag adhesive that forms strong bonds to metals and ceramics. H.B. Fuller MP5401 has exceptional thermal stability and resistance to water, humidity, and solvents. This product offers high heat resistance and cures in less than 36 seconds via induction or infrared heating. Its typical uses include permanent magnet motors and loudspeaker assembly, air conditioning joint tubes and processors, high-temperature structural bonding, filter end caps, and side seam assembly.

Chemical FamilyEpoxides, Epoxy & Epoxy Derivatives

Product Type1K (1 component) Adhesive, Epoxy Adhesive, Reactive Adhesive, Structural Adhesive

Application AreaAir Conditioners, Electric Motors, Electric Vehicle (EV), HVAC Applications, Joints, Tubes

Compatible Substrates & SurfacesCeramic, Metal

FeaturesChemical Resistant, Excellent Water Resistance, Good Sagging Resistance, Good Solvent Resistance, Good Thermal Stability, Heat Resistance, Thixotropic

Technical Data Sheet

Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Cure Method
General Instructions
  • Surfaces to be bonded must be clean, dry and free of other contaminants.
  • Bring material to room temperature prior to dispensing.
  • Dispense without introducing bubbles.
  • Press flow time for the material is 60 to 80 seconds.
  • Allow to cure undisturbed until product is fully gelled or tack-free to the touch ensuring parts remain mated throughout the cure process.


Physical Form
Grey liquid paste
Cured Properties
ValueUnitsTest Method / Conditions
Hardness86.0ASTM D2240
Tensile Strength46.7MPaASTM D638
Elongation at Break1.5 - 4%ASTM D638
Overlap Shear Strength (Aluminum, acid etched, at 50% RH)22.1MPaASTM D1002
Operating Temperature- 40 - 205°C
Glass Transition Temperature148.0°C
Coefficient of Thermal Expansion (Alpha 1)57.2ppm/°C
Thermal Conductivity0.41W/m.K
Uncured Properties
ValueUnitsTest Method / Conditions
Cure Time (at 120°C)10.0min
Cure Time (at 175°C)1.0min
Cure Time (at 150°C)2.0min
Rheological Properties
ValueUnitsTest Method / Conditions
Viscosity Thixotropic Index700,000 - 900,000cP

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America

Storage & Handling

Shelf Life
12 Months (at 0°C), 6 Months (at 23°C)
Storage Conditions

Product should be stored in a cool dry place out of direct sunlight.