- Chemical Family:Epoxy & Epoxy Derivatives, Epoxides
- Product Type:Epoxy Adhesive, Reactive Adhesive, 1K (1 component) Adhesive, Structural Adhesive
- Application Area:Joints, Electric Vehicle (EV), Electric Motors, Air Conditioners, Tubes, HVAC Applications
- Compatible Substrates & Surfaces:Ceramic, Metal
- Features:Chemical Resistant, Good Thermal Stability, Thixotropic, Excellent Water Resistance, Good Sagging Resistance, Good Solvent Resistance, Heat Resistance
H.B. Fuller MP5401 is a one-component, heat-curable, thixotropic epoxy paste adhesive. It is a non-sag adhesive that forms strong bonds to metals and ceramics. H.B. Fuller MP5401 has exceptional thermal stability and resistance to water, humidity, and solvents. This product offers high heat resistance and cures in less than 36 seconds via induction or infrared heating. Its typical uses include permanent magnet motors and loudspeaker assembly, air conditioning joint tubes and processors, high-temperature structural bonding, filter end caps, and side seam assembly.