H.B. Fuller FH8008

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

Chemical Family: Epoxy & Epoxy Derivatives

Product Type: 1K (1 component) Adhesive, Reactive Adhesive, Underfill Adhesive

Application Area: Electronic Components

Features: Excellent Filling Properties, Fast Cure, Good Gap Filling Capabilities, High Reliability

Technical Data Sheet
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Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Features and Benefits
  • Fast cure at moderate temperature minimizing stress on components.
  • Reworkable without damage to the attach pad
  • High reliability design for portable device
  • Single Component

Applications & Uses

Application Area
Cure Method
Preparation for Material Usage

1. Do not open the package before complete the thawing.
2. Thawing to room temperature (25°C) before using.
3. Seal any remaining material and store immediately at -18℃.
4. We do not recommend thawing material more than three times.


Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.


Physical Properties of Cured Material
ValueUnitsTest Method / Conditions
Transition Temperature (cured at 120C°, 30 min)108.0°C-
Coefficient of Thermal Expansion (Alpha 1, cured at 120C°, 30 min)89.0m/m.°C-
Coefficient of Thermal Expansion (Aplha 2, cured at 120C°, 30 min)226.0m/m.°CASTM E-831
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Strength25.0kV/mmASTM D-149
Surface Resistivity1.2 x 10¹⁶ohmASTM D-257
Volume Resistivity4.1 x 10¹⁶Ω.cmASTM D-257
Uncured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.15--
Viscosity (Brookfield CP42, 100 rpm, at 25°C)510.0cP-
Working Pot Life3.0days-

Technical Details & Test Data

Curing Profile
  • Recommended cure conditions:
    • 8 minutes @ 150℃
  • Curing speed will vary depending on oven temperatures profile efficiency, printed circuit board thickness

Storage & Handling

Shelf Life
6 Months
Storage Conditions

FH8008 is supplied in 30ml/syringes
It should be stored in a -18°C refrigerator.
Shelf life is 6 months from date of manufacture.