Products

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller FH8710 is a one-component epoxy adhesive that has excellent toughness and bonding strength. This halogen-free structural bonding adhesive has good mechanical properties and reliability properties. It has a very high bonding strength to multiple materials, especially inorganic materials.

H.B. Fuller EV Bond 343 is a medium-hardness, semi-flexible two– component polyurethane adhesive designed for bonding applications requiring resilient bonds, non-sag application and enhanced adhesion to flexible substrates. EV Bond 343 is suitable for bonding metals, ceramics, natural rubber, thermosetting polymers and select types of unprepared thermoplastic substrates such as ABS, polycarbonate and nylon.

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller FH8516 is a two-part, room-temperature-curing epoxy adhesive that offers high strength, good flexibility, and excellent impact strength after curing. This product is specifically designed for bonding a variety of substrates, including composite, metal, glass, and ceramic, where high reliability is needed.

H.B. Fuller Beauty HB6300 is a water-based adhesive tailored for at-home false eyelash users. It offers prolonged eyelash application with non-irritating components, sourced from certified suppliers.H.B. Fuller Beauty HB6300 ensures enhanced wear and safety, allowing longer intervals between maintenance. This product provides a convenient and cost-effective solution for daily eyelash enhancement.

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller Beauty HB6212 offers at-home false eyelash consumers a water-based adhesive solution, providing extra time for application. H.B. Fuller Beauty HB6212 features non-irritating components for a 7+ day wear time, ensuring reliability without harming the eyes or skin. This slow-drying formula saves time and money, facilitating easy maintenance of eyelashes at home.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

H.B. Fuller FH8009 is a brown-colored epoxy-based underfill adhesive designed for electronic components, particularly printed circuit boards (PCBs). This ready-to-use product offers excellent flow properties, ensuring smooth and precise application. FH8009 provides high reliability, ensuring secure and long-lasting bonding of components.

Bacon Adhesives P-182 is a highly filled, high-performance epoxy adhesive. It is a reactive-chemistry epoxy that exhibits low thermal expansion and excellent dimensional stability. This adhesive meets NASA's outgassing requirements and is non-magnetic. With its high strength and high modulus, Bacon Adhesives P-182 is ideal for high reliability and high-performance applications in space exploration.

Advantra® BOLD 9430 is the culmination of twenty years of Advantra® technology and industry experience. This adhesive is known for its versatility and reliability, particularly in case and carton sealing applications. It offers excellent thermal stability, clean running, and greater efficiency, setting a new standard for adhesives in this category.

H.B. Fuller FH8513 is a 2K epoxy adhesive developed for structure bonding in portable devices. One notable advantage of FH8513 is its design for device assembly. It is formulated to provide reliable and durable bonds when joining various components in portable devices. It also offers a long open time, which refers to the duration during which the adhesive remains workable after mixing its two components. In addition, H.B. Fuller FH8513 exhibits high toughness, meaning it can withstand mechanical stresses and impacts without compromising the bond strength.

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.