Products

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller PU1925 is designed for bonding and filling applications, particularly for panels and material joints. One of the key advantages of H.B. Fuller PU1925 is its very good bonding strength. This means that it forms strong and durable bonds between panels and materials, providing reliable adhesion. Another benefit of H.B. Fuller PU1925 is its ease of dispensing. H.B. Fuller PU1925 also exhibits outstanding filling, sealing, and tooling properties.

H.B. Fuller FH8707HF is a black-colored epoxy-based adhesive designed for a wide range of applications in electronic components, printed circuit boards (PCBs), electric motors, and automotive electrical and electronic systems. This heat-curable adhesive offers excellent filling properties, high strength, and good electrical properties. It exhibits improved aging resistance, ensuring long-term durability.

Millennium PG-1 EF ECO2 is a two-component, low-rise, solvent-free polyurethane foamable adhesive that contains no high Global Warming Potential (GWP) blowing agents. Instead, it uses naturally found atmospheric gases as blowing agents, eliminating the need for chemical alternatives such as HFCs and HFOs, and reducing its environmental footprint. With quick and easy application, the adhesive sets in minutes, providing significant labor savings for contractors. Packaged in dual pressurized canisters and dispensed through a disposable adhesive applicator with twenty-five-foot hoses, this patented product eliminates the need for additional equipment.