Products

H.B. Fuller PU1956 is designed for bonding applications. One of the key advantages of H.B. Fuller PU1956 is its very good bonding strength to glass, metal, and other materials. This adhesive forms strong and durable bonds, providing reliable adhesion between different substrates. Another notable feature of H.B. Fuller PU1956 is its outstanding weather and aging resistance. H.B. Fuller PU1956 also exhibits good filling and sealing properties. It is well-suited for applications in the appliance industry, as well as other industries that require durable and weather-resistant bonding solutions.

H.B. Fuller PU1925 is designed for bonding and filling applications, particularly for panels and material joints. One of the key advantages of H.B. Fuller PU1925 is its very good bonding strength. This means that it forms strong and durable bonds between panels and materials, providing reliable adhesion. Another benefit of H.B. Fuller PU1925 is its ease of dispensing. H.B. Fuller PU1925 also exhibits outstanding filling, sealing, and tooling properties.

H.B. Fuller FH8707HF is a black-colored epoxy-based adhesive designed for a wide range of applications in electronic components, printed circuit boards (PCBs), electric motors, and automotive electrical and electronic systems. This heat-curable adhesive offers excellent filling properties, high strength, and good electrical properties. It exhibits improved aging resistance, ensuring long-term durability.

TEC® VersaPatch® Latex Modified Floor Patch and Leveler TA-327 is a rapid-setting cement-based solution, meticulously crafted for patching and repairing floor imperfections. This versatile product adeptly fills cracks, voids, seams, and depressions on various floor surfaces, ranging from featheredge up to 1/2" (12 mm) deep. With a smooth and level finish achieved through flat trowel application, this solution ensures a seamless, non-cracking surface. The resultant surface provides an optimal foundation for the installation of a range of flooring options, including sheet goods, resilient tile, carpet, wood, and ceramic or stone tile.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.