H.B. Fuller FH6501

H.B. Fuller FH6501 is a one-part epoxy adhesive specifically designed for potting and bonding electronic components. It is a heat-curable epoxy that offers excellent thermal conductivity. This product is commonly used in applications requiring thermally conductive properties, such as in electric motors.

Chemical Family: Epoxy & Epoxy Derivatives

Product Type: 1K (1 component) Adhesive, Contact Adhesive, Epoxy Adhesive, Potting Compound, Reactive Adhesive, Thermal Adhesive

Application Area: Electric Motors, Electronic Components

Features: Good Thermal Conductivity

Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features

Applications & Uses

Cure Method

Packaging & Availability

Regional Availability
  • Asia Pacific
  • Latin America
  • North America