H.B. Fuller FH8302

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

Product Type: 1K (1 component) Adhesive, Encapsulant, Epoxy Adhesive, Underfill Adhesive

Application Area: Flip Chip Applications, Printed Circuit Boards

Features: Electrically Insulating, Excellent Flowability, Good Adhesion, High Glass Transition Temperature, High Modulus, High Reliability

Technical Data Sheet
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Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Features and Benefits
  • Low CTE
  • High Tg
  • High reliability design for flip chip on board applications

Applications & Uses

Application Area
Cure Method
Preparation for Material Usage

1. Do not open the package before completely thawing.

2. Thaw to room temperature (25°C) before using. Any moisture present on the container after thawing should be removed before opening the container.

3. Seal any remaining material and store immediately at -40°C.

4. Once removed from original packaging, allow thawing syringes to equilibrate in tip-down orientation. Handle only the tip or flange. Do not handle syringes from the body.

5. Do not thaw material more than one time.

Directions for Use

Selection of dispense equipment should be determined by application requirements - for advice on equipment selection and process optimization, users should contact HB Fuller technical support.

1. Ensure that air is not introduced to product during equipment set-up.

2. For best results, the substrate should be preheated to 80 to 100 °C. Ensure that the component and substrate have reached the prescribed temperature prior to dispensing the material. Measuring the substrate temperature adjacent to the component using a thermocouple is recommended.

3. The product can be dispensed using a pneumatic, auger or jet pump dispensing system.

4. Contact HB Fuller technical support for dispensing process recommendations.


Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.


Filler Content
Physical Properties of Cured Material
ValueUnitsTest Method / Conditions
Modulus (at 25°C)7870.0MPaDMA
Transition Temperature (Trimethylamine)120.0°C-
Coefficient of Thermal Expansion (Alpha 1)32.0m/m.°CASTM E-831
Coefficient of Thermal Expansion (Aplha 2)103.0m/m.°CASTM E-831
Thermal Conductivity0.27W/m.KHBF
Uncured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.6--
Viscosity (Brookfield CP52, 100 rpm, at 25°C)3400.0cP-
Capillary Flow Rate Flow Time (at 100°C flip chip 5mm, 0.2mm pitch, peripheral array bumps)42.0sec-
Maximum Particle Size3.0μm-
Average Particle Size0.7μm-
DSC Peak168.0°C-
DSC Onset149.0°C-
Working Pot Life (at 23°C)8.0h-

Technical Details & Test Data

Curing Profile
  • Recommended cure schedule is 120 minutes at 165°C
  • Curing speed will vary depending on oven temperatures profile efficiency, die size and substrate thickness.

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America

Storage & Handling

Shelf Life
6 Months
Storage Conditions

FH8301 is supplied in 10 cc/syringes
It should be stored in a -40°C freezer.
Shelf life is 6 months from date of manufacture.