Products

H.B. Fuller 1521 is a two-component, room-temperature-cure silicone system. It has very low ionic content and can be used for electronic component applications and electronics potting. Its applications include appliance sealing, connector sealing, and junction box potting. Additionally, it has good thermal conductivity and flame retardancy.

H.B. Fuller EV Protect 5006 offers battery designers the ability to integrate high-level structural performance characteristics into their battery system, which is ideal for cell to pack applications. This ultra-lightweight material minimizes weight addition to the battery pack and, when exposed to a thermal event, significantly reduces or delays thermal propagation. With a reduced viscosity and improved curing speed, the EV Protect 5006 is especially advantageous for those with unique, complex, or intricate battery design architecture. Works in all types of battery cell form factors (cylindrical, prismatic, or pouch).

H.B. Fuller TL0600 A/B is a 2K urethane with an amber color and high viscosity. H.B. Fuller TL0600 A/B is commonly used for potting filters and applications where the adhesive is exposed to blood. Its uses also include filter potting.

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller FH4003AB is a general epoxy encapsulant. It falls under the epoxy category and is commonly used for charger handle encapsulation and general potting applications. This epoxy is specifically suitable for potting and encapsulating electric vehicles (EVs), providing effective encapsulation and protection for EV components.

Foster® Bridging Encapsulant 32-32 is a single-component, water-based elastomeric product with pigmentation. It is designed for interior use over asbestos-containing materials (ACM) of fibrous and cementitious types. This product can be easily applied via spray, and once cured, it forms a resilient, durable elastomeric film over the ACM. This film effectively delays the release of friable asbestos fibers.

Tonsan® EP832 is an epoxy adhesive known for its high strength, good toughness, and heat resistance up to 150°C in the long term and 180°C in the short term. With its low viscosity, it is suitable for potting bonding and exhibits excellent bonding performance to metal, stone, wood, ceramic, and most plastics. This adhesive is commonly used in the electric vehicle industry.

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

Foster® Chil-Bridge™ CP-211 is a polymeric, water-based coating designed for the protection and isolation of asbestos-containing materials (ACM). It is suitable for use in both indoor and outdoor applications. When applied over various forms of ACM, it effectively bridges, encases, and seals friable asbestos fibers.

H.B. Fuller PHOTOCAP® 15580P is an ultrafast-curing, PID-resistant EVA (ethylene vinyl acetate copolymer) photovoltaic encapsulating film designed for use in all photovoltaic devices. This product exhibits a short lamination cycle, excellent light transmission, along with outstanding stability in the field.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.

H.B. Fuller PHOTOCAP® 15585P is an ultrafast-curing, PID-resistant EVA (ethylene vinyl acetate copolymer) photovoltaic encapsulating film with HLT™ higher light transmission in the UV wavelength region to allow greater power generation with blue light-sensitive photovoltaic devices. It has a short lamination cycle, excellent light transmission, and outstanding stability in the field.

H.B. Fuller EA6042 is a high-performance, fluorescence, fast UV-cure adhesive and encapsulant. This product has a tack-free surface finish and good electrical insulation performance. It has excellent precision dispensing and jetting performance. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. It has excellent adhesion and is flexible.

H.B. Fuller EV Protect 4006 is a liquid-applied, two-component, flame-retardant, low-density polyurethane foam material designed for the potting and encapsulation of battery cells in EV battery modules. EV Protect 4006 SFR offers battery design engineers the ability to increase the power density of their modules while enhancing safety and protection from thermal propagation. The ultra lightweight nature of the EV Protect 4006 SFR minimizes the weight impact to the battery modules. The semi-structural properties of the material also provide noise, vibration, and harshness benefits to the battery system by unitizing the battery module and absorbing external environmental impacts.