Enhanced TDS
Identification & Functionality
- Chemical Family
- Polymer Name
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Application Area
- Plastics & Elastomers End Uses
- Typical Applications
PHOTOCAP® 15580P is typically used in crystalline silicon modules, often behind the cells with a high light transmission material such as PHOTOCAP® 15585P in front.
- Lamination Instructions
- Platen temperature: 140 - 150°C
- Evacuation Time: 180 - 300 seconds
- Cure Time: 300 - 360 seconds
Properties
- Physical Form
- Typical Properties
Value Units Test Method / Conditions Tensile Strength 15.0 MPa ASTM D638 Shrinkage (Transverse direction) max. 1 % IEC 62788 Ultimate Elongation 530.0 % ASTM D638 Shrinkage (Machine direction) max. 3 % IEC 62788 Adhesion (Glass) 120.0 N/cm HBF Adhesion (Backsheet) 60.0 N/cm HBF Moisture Vapor Transmission Rate max. 25 g/m²/24 hrs AFTM F1249 Water Absorption max. 0.5 wt.% ASTM D570 Optical Transmission 92.0 % ASTM E424 UV Cut-off 360.0 nm ASTM E424 Volume Resistivity min. 5 x 10¹⁵ Ohm cm ASTM D257 Dielectric Strength min. 25 KV/mm ASTM D149 Comparative Tracking Index 600.0 V IEC 60112
Regulatory & Compliance
- Regulatory Information
PHOTOCAP 15580P is a UL listed product in category QIHE2 Photovoltaic Polymeric Materials. Each HB Fuller manufacturing plant maintains a separate UL file. Please refer to UL file numbers E10488, E335471 and E335472.
Safety & Health
- Safety Information
Avoid contact with skin and eyes. Product will irritate eyes if contact occurs. Skin irritation is possible on prolonged or repeated contact.
Packaging & Availability
- Regional Availability
Storage & Handling
- Storage Conditions
Clean and dry conditions below 40°C and 70% RH. For best performance, the product should be stored and used at 65°F – 85°F. Do not freeze.