Products

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller PHOTOCAP® 15580P is an ultrafast-curing, PID-resistant EVA (ethylene vinyl acetate copolymer) photovoltaic encapsulating film designed for use in all photovoltaic devices. This product exhibits a short lamination cycle, excellent light transmission, along with outstanding stability in the field.

H.B. Fuller FH4008AB is a two-component epoxy adhesive formulated for potting applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FH4008AB is its excellent isolation resistance. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. Another notable feature of H.B. Fuller FH4008AB is its resistance to aging hardening. This means that the adhesive maintains its performance and properties over time, even under prolonged exposure to various environmental conditions. Furthermore, H.B. Fuller FH4008AB offers a high service temperature, indicating its ability to withstand elevated temperatures without significant degradation.

H.B. Fuller FH3911 A/B is a two-component adhesive and encapsulant widely used in casting applications. It belongs to the urethane chemical family and exhibits a transparent color. This product offers various features and benefits, including biocompatibility, clarity, low outgassing, low viscosity, and optical clarity. It is suitable for multiple application areas, such as potting compounds in electrical and electronics packaging and assembly, as well as printed circuit boards (PCBs).

H.B. Fuller EV Protect 5006 offers battery designers the ability to integrate high-level structural performance characteristics into their battery system, which is ideal for cell to pack applications. This ultra-lightweight material minimizes weight addition to the battery pack and, when exposed to a thermal event, significantly reduces or delays thermal propagation. With a reduced viscosity and improved curing speed, the EV Protect 5006 is especially advantageous for those with unique, complex, or intricate battery design architecture. Works in all types of battery cell form factors (cylindrical, prismatic, or pouch).

Foster® Protektor® Sealant 32-21 is a single-component acrylic copolymer coating used for abating asbestos fiber fallout through the retention method. This sealant penetrates asbestos-containing materials deeply, drying to establish a firm, lightweight, and damage-resistant surface. It is applied using an airless spray, with a mild odor when wet and none when dry.

Tonsan® 1533 White is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, particularly junction boxes on PV modules. It has excellent dielectric properties and V1 flame retardancy.

H.B. Fuller FH8050 is an electrically insulating, one-component epoxy encapsulant and bonding material. It is specifically designed to cure during lead-free solder reflow while allowing self-alignment of IC components. This corner bonding material improves the mechanical reliability of hand-held devices.

Tonsan® 1581 is a one-part RTV alkoxy-cured silicone specifically designed for FIPG gasketing applications. It is known for its excellent sealing properties and is commonly used for sealing enclosures and packs. This silicone adhesive is an ideal choice for EV sealants.

H.B. Fuller PHOTOCAP® 3610 is an ultra-fast cure and PID resistant thermoset polyolefin encapsulant with HLT™ higher light transmission in the UV wavelength region to allow greater power generation with blue light-sensitive photovoltaic devices. It has a low MVTR, a short lamination cycle, and excellent light transmission with no acetic acid concerns.

H.B. Fuller EV Protect 5008HD is an encapsulant, designed for electrical and electronics applications, specifically for parts and components in batteries and electric vehicles (EVs).

H.B. Fuller PHOTOCAP® 6048 is a thermoplastic, non-EVA-based encapsulating film designed for use in thin film modules.  It has a low MVTR (moisture vapor transmission rate), a short lamination cycle, and good creep resistance with proven longevity in the field.

Tonsan® 1533 Black is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, typically for the junction box on PV modules. It has excellent dielectric properties and V1 flame retardancy.

H.B. Fuller PHOTOCAP® 15585P is an ultrafast-curing, PID-resistant EVA (ethylene vinyl acetate copolymer) photovoltaic encapsulating film with HLT™ higher light transmission in the UV wavelength region to allow greater power generation with blue light-sensitive photovoltaic devices. It has a short lamination cycle, excellent light transmission, and outstanding stability in the field.

Tonsan® 1521 White is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, particularly junction boxes on PV modules. It has good thermal conductivity and flame retardancy.