Products

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller FH8707HF is a black-colored epoxy-based adhesive designed for a wide range of applications in electronic components, printed circuit boards (PCBs), electric motors, and automotive electrical and electronic systems. This heat-curable adhesive offers excellent filling properties, high strength, and good electrical properties. It exhibits improved aging resistance, ensuring long-term durability.

H.B. Fuller EU2002HV is a solvent-based adhesive with excellent mechanical and chemical resistance. However, one distinguishing characteristic of EU2002HV is its high viscosity. H.B. Fuller EU2002HV is primarily used for conformal coating applications, providing a protective layer on circuit boards. The low odor feature enhances the user experience by minimizing any unpleasant smells during the application process.

H.B. Fuller EU2002 is a solvent-based adhesive formulated for use as a conformal coating, providing protection for circuit boards in various applications. H.B. Fuller EU2002 is primarily used for conformal coating, a process of applying a protective layer onto circuit boards to shield them from environmental factors such as moisture, dust, and chemicals. The adhesive is commonly applied to circuit board protection, where it provides a reliable barrier against the elements and safeguards the sensitive electronic components.

H.B. Fuller EA6111 is a fast cure, low-viscosity, UV/moisture double-cure adhesive. This product is a conformal coating material designed for protection from moisture and harsh chemicals. It can be cured in shadowed areas. This product is designed for circuit board protection.

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller FH3911 A/B is a two-component adhesive and encapsulant widely used in casting applications. It belongs to the urethane chemical family and exhibits a transparent color. This product offers various features and benefits, including biocompatibility, clarity, low outgassing, low viscosity, and optical clarity. It is suitable for multiple application areas, such as potting compounds in electrical and electronics packaging and assembly, as well as printed circuit boards (PCBs).

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller FH4008AB is a two-component epoxy adhesive formulated for potting applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FH4008AB is its excellent isolation resistance. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. Another notable feature of H.B. Fuller FH4008AB is its resistance to aging hardening. This means that the adhesive maintains its performance and properties over time, even under prolonged exposure to various environmental conditions. Furthermore, H.B. Fuller FH4008AB offers a high service temperature, indicating its ability to withstand elevated temperatures without significant degradation.

H.B. Fuller FH1270 is a two-part polyurethane (PU) adhesive known for its high solids content and thermosetting properties. It is a non-toxic film used primarily as an insulating compound to coat printed circuit assemblies. This PU adhesive is designed to provide protection against moisture, mold, dust, corrosion, and other extreme environmental stresses. Its main applications include electronics protection and the insulation of electric motors.

H.B. Fuller EA6107 is a double-cure adhesive that cures rapidly under UV light or ambient temperature and humidity. It is a no-flow adhesive that is specifically formulated for bonding plastics and metals, and can even cure in shadowed areas. It is ideal for applications that require fast curing times and excellent bonding properties.

H.B. Fuller EA6034 is a one-component UV adhesive that cures quickly and is specifically designed for reinforcing Flexible Printed Circuit (FPC) applications. The adhesive dries to a non-tacky surface and offers excellent flexibility. Additionally, this adhesive is fast-curing and does not require mixing.

H.B. Fuller FS3000 is a one-component silicone adhesive designed for conformal coating applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FS3000 is its good dielectric properties. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. By utilizing H.B. Fuller FS3000 for conformal coating in circuit board protection, manufacturers can benefit from its good dielectric properties and corrosion-free characteristics.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

H.B. Fuller FH8009 is a brown-colored epoxy-based underfill adhesive designed for electronic components, particularly printed circuit boards (PCBs). This ready-to-use product offers excellent flow properties, ensuring smooth and precise application. FH8009 provides high reliability, ensuring secure and long-lasting bonding of components.