Enhanced TDS
Identification & Functionality
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Features and Benefits
- Low CTE
- High Tg
- High Modulus
- High reliability design for flip chip on board applications
Applications & Uses
- Applications
- Application Area
- Cure Method
- Preparation for Material Usage
1. Do not open the package before completely thawing.
2. Thaw to room temperature (25°C) before using. Any moisture present on the container after thawing should be removed before opening the container.
3. Seal any remaining material and store immediately at -40°C.
4. Once removed from original packaging, allow thawing syringes to equilibrate in tip-down orientation. Handle only the tip or flange. Do not handle syringes from the body.
5. Do not thaw material more than one time.
- Directions for Use
Selection of dispense equipment should be determined by application requirements - for advice on equipment selection and process optimization, users should contact HB Fuller technical support.
1. Ensure that air is not introduced to product during equipment set-up.
2. For best results, the substrate should be preheated to 80 to 100 °C. Ensure that the component and substrate have reached the prescribed temperature prior to dispensing the material. Measuring the substrate temperature adjacent to the component using a thermocouple is recommended.
3. The product can be dispensed using a pneumatic, auger or jet pump dispensing system.
4. Contact HB Fuller technical support for dispensing process recommendations.
- Clean-Up
Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.
Properties
- Color
- Filler Content
- 55.0
- Physical Properties of Cured Material
- Uncured Properties
| Value | Units | Test Method / Conditions | |
| Modulus (at 25°C) | 14570.0 | MPa | DMA |
| Transition Temperature (Trimethylamine) | 105.0 | °C | - |
| Transition Temperature (Dimethylacetamide) | 122.0 | °C | - |
| Coefficient of Thermal Expansion (Alpha 1) | 35.0 | m/m.°C | ASTM E-831 |
| Coefficient of Thermal Expansion (Aplha 2) | 122.0 | m/m.°C | ASTM E-831 |
| Thermal Conductivity | 0.33 | W/m.K | HBF |
| Value | Units | Test Method / Conditions | |
| Specific Gravity | 1.6 | - | - |
| Viscosity (Brookfield CP52, 100 rpm, at 25°C) | 19900.0 | cP | - |
| Capillary Flow Rate Flow Time (at 100°C flip chip 5mm, 0.2mm pitch, peripheral array bumps) | 50.0 | sec | - |
| Maximum Particle Size | 3.0 | μm | - |
| Average Particle Size | 0.7 | μm | - |
| DSC Peak | 189.0 | °C | - |
| DSC Onset | 149.0 | °C | - |
| Working Pot Life (at 23°C) | 8.0 | h | - |
Technical Details & Test Data
- Curing Profile
- Recommended cure schedule is 120 minutes at 165°C
- Curing speed will vary depending on oven temperatures profile efficiency, die size and substrate thickness.
Packaging & Availability
- Regional Availability
Storage & Handling
- Shelf Life
- 6 Months
- Storage Conditions
FH8301 is supplied in 10 cc/syringes
It should be stored in a -40°C freezer.
Shelf life is 6 months from date of manufacture.