Products

H.B. Fuller EA6110 is a double-cure adhesive that cures rapidly under UV light or ambient temperature and humidity. It is a no-flow adhesive that is specifically formulated for bonding plastics and metals, and can even cure in shadowed areas. It is ideal for applications that require fast curing times and excellent bonding properties.

H.B. Fuller EA6111 is a fast cure, low-viscosity, UV/moisture double-cure adhesive. This product is a conformal coating material designed for protection from moisture and harsh chemicals. It can be cured in shadowed areas. This product is designed for circuit board protection.

H.B. Fuller FH1280AB is a yellow-colored epoxy-based coating specifically formulated for electronic components, particularly printed circuit boards (PCBs). This ready-to-use 2K (2 component) product offers a range of valuable features. It provides excellent chemical resistance, ensuring durability and protection for electronic parts. FH1280AB also exhibits good adhesion and mechanical resistance, ensuring reliable performance in demanding applications.

H.B. Fuller UV890SF-150D is a 1-part UV-curable conformal coating adhesive. It is a single-component adhesive with low viscosity and solvent-free properties. UV890SF can be applied using a brush, dip, or spray method. It is commonly used to protect printed circuit boards (PCBs) in various high-reliability applications, making it an ideal conformal coating material for electronic components, including electric motors.

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.

Bacon Adhesives Thermally Conductive 442 is a thermally conductive polyurethane adhesive with low outgassing properties. It is specifically designed for bonding glass diodes or other stress-sensitive components. This adhesive offers excellent electrical properties and high flexibility. It is well-suited for circuit board assembly and protection in space exploration applications.

H.B. Fuller FH8050 is an electrically insulating, one-component epoxy encapsulant and bonding material. It is specifically designed to cure during lead-free solder reflow while allowing self-alignment of IC components. This corner bonding material improves the mechanical reliability of hand-held devices.

H.B. Fuller FH8009 is a brown-colored epoxy-based underfill adhesive designed for electronic components, particularly printed circuit boards (PCBs). This ready-to-use product offers excellent flow properties, ensuring smooth and precise application. FH8009 provides high reliability, ensuring secure and long-lasting bonding of components.

H.B. Fuller FS3000 is a one-component silicone adhesive designed for conformal coating applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FS3000 is its good dielectric properties. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. By utilizing H.B. Fuller FS3000 for conformal coating in circuit board protection, manufacturers can benefit from its good dielectric properties and corrosion-free characteristics.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

H.B. Fuller EA6034 is a one-component UV adhesive that cures quickly and is specifically designed for reinforcing Flexible Printed Circuit (FPC) applications. The adhesive dries to a non-tacky surface and offers excellent flexibility. Additionally, this adhesive is fast-curing and does not require mixing.

H.B. Fuller FH1270 is a two-part polyurethane (PU) adhesive known for its high solids content and thermosetting properties. It is a non-toxic film used primarily as an insulating compound to coat printed circuit assemblies. This PU adhesive is designed to provide protection against moisture, mold, dust, corrosion, and other extreme environmental stresses. Its main applications include electronics protection and the insulation of electric motors.

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller 1536 is a gray, flowable, one-component, neutral alkoxy-cure silicone sealant. Low-odor, solvent-free materials cure at room temperature when exposed to moisture in the atmosphere. With fast tacky-free time and meets the UL94-V0 flame rating. Excellent adhesion to glass, ABS, FR4, and PCBs. Superior resistance to thermal cycling, damp heat, and damp freezing Typical applications include electronics encapsulation, connector staking, electronics potting, circuit board encapsulation, electrical component reinforcement, electronic component bonding, and sealing.