H.B. Fuller FH4008AB

H.B. Fuller FH4008AB is a two-component epoxy adhesive formulated for potting applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FH4008AB is its excellent isolation resistance. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. Another notable feature of H.B. Fuller FH4008AB is its resistance to aging hardening. This means that the adhesive maintains its performance and properties over time, even under prolonged exposure to various environmental conditions. Furthermore, H.B. Fuller FH4008AB offers a high service temperature, indicating its ability to withstand elevated temperatures without significant degradation.

Product Type: 2K (2 component) Adhesive, Encapsulant, Potting Compound

Application Area: Printed Circuit Boards

Chemical Family: Epoxy & Epoxy Derivatives

Features: High Dielectric Strength, High Temperature Performance, Low Moisture Absorption

Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application Area

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • North America