Products

H.B. Fuller FH3911 A/B is a two-component adhesive and encapsulant widely used in casting applications. It belongs to the urethane chemical family and exhibits a transparent color. This product offers various features and benefits, including biocompatibility, clarity, low outgassing, low viscosity, and optical clarity. It is suitable for multiple application areas, such as potting compounds in electrical and electronics packaging and assembly, as well as printed circuit boards (PCBs).

Tonsan® EP843 is an epoxy adhesive known for its high strength and heat resistance, capable of withstanding temperatures up to 150°C in the long term and 180°C in the short term. It has a high viscosity, making it suitable for potting bonding applications where thixotropic properties are desired, preventing flow on vertical surfaces. This adhesive is specifically designed for bonding metal and other parts in high-temperature and harsh conditions, making it ideal for use in the electric vehicle industry.

H.B. Fuller FH4003AB is a general epoxy encapsulant. It falls under the epoxy category and is commonly used for charger handle encapsulation and general potting applications. This epoxy is specifically suitable for potting and encapsulating electric vehicles (EVs), providing effective encapsulation and protection for EV components.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller TL 0587 is a two-component polyurethane potting material with excellent flexibility, suitable for general potting/encapsulation and electric vehicles. It belongs to the polyurethane (PU) chemical family and is a 2K reactive adhesive and encapsulant. H.B. Fuller TL 0587 is categorized under bonding technology and potting compounds within adhesives and sealants technologies.

Tonsan® EP832 is an epoxy adhesive known for its high strength, good toughness, and heat resistance up to 150°C in the long term and 180°C in the short term. With its low viscosity, it is suitable for potting bonding and exhibits excellent bonding performance to metal, stone, wood, ceramic, and most plastics. This adhesive is commonly used in the electric vehicle industry.

H.B. Fuller 2532 is a two-component addition type thermal conductive potting material with room temperature and heating fast cure silicone system. This material has excellent conductivity insulation, flame retardancy, weather resistance, and high temperature resistance. H.B. Fuller 2532 is formulated to function as a bonding, sealing, and encapsulating material for electronic components. This material performs at temperatures ranging from -60°C to 210°C.

H.B. Fuller EV Protect 300 is a two-component, low viscosity polyurethane encapsulating system that is designed for potting and encapsulating of battery cells in battery modules. This product offers battery designers the ability to enhance safety and protection from thermal propagation.

ISOLENE® 400-S is a low-molecular-weight liquid polymer derived from synthetic polyisoprene rubber. It offers the performance and processing characteristics of natural rubber with the added benefit of a lighter color and none of the natural impurities inherent in natural rubber products. ISOLENE® 400-S is a high-viscosity liquid at room temperature. It is a translucent, honey-colored liquid in bulk form and virtually clear in a thin film.

ISOLENE® 40-S is a low-molecular-weight liquid polymer derived from synthetic polyisoprene rubber. It offers the performance of natural rubber with the added benefit of a lighter color and none of the natural impurities inherent in natural rubber products. ISOLENE® 40-S is a lower viscosity liquid than the other ISOLENE® liquid rubber products. It is a translucent, honey-colored liquid in bulk form and virtually clear in a thin film.

H.B. Fuller FH8732B is a one-part epoxy adhesive that serves as a heat curable potting material. It offers good flow and is effective at filling gaps at room temperature. This epoxy is primarily used as an excellent heat cure encapsulant with low coefficient of thermal expansion (CTA) in electronics applications, specifically for electric motors.

H.B. Fuller FH8707HF is a black-colored epoxy-based adhesive designed for a wide range of applications in electronic components, printed circuit boards (PCBs), electric motors, and automotive electrical and electronic systems. This heat-curable adhesive offers excellent filling properties, high strength, and good electrical properties. It exhibits improved aging resistance, ensuring long-term durability.

H.B. Fuller FH4008AB is a two-component epoxy adhesive formulated for potting applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FH4008AB is its excellent isolation resistance. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. Another notable feature of H.B. Fuller FH4008AB is its resistance to aging hardening. This means that the adhesive maintains its performance and properties over time, even under prolonged exposure to various environmental conditions. Furthermore, H.B. Fuller FH4008AB offers a high service temperature, indicating its ability to withstand elevated temperatures without significant degradation.

H.B. Fuller 1535 is a one-component, silicone adhesive sealant that cures on exposure to atmospheric moisture to form a silicone elastomer. This material is known for its excellent electrical properties, weather stability, chemical resistance, flame retardancy, and thermal conductivity. It exhibits good adhesion to most common building substrates, such as glass, metal, plastic, FR4, and lead frames.

H.B. Fuller EY1514AB is a 2K thermally conductive epoxy adhesive suitable for general potting/encapsulation and electric vehicles. It belongs to the epoxy and epoxy derivatives chemical family and is a conductive and reactive encapsulant. It is categorized under 2K liquid reactive adhesives and functional adhesives within adhesives and sealants technologies and is used in potting compounds for electrical and electronics applications.