Products

H.B. Fuller FH7026 is a two-part, room-temperature-curing acrylic adhesive. This material is designed to meet the requirements for structural bonding in electronic assemblies. It cures rapidly at room temperature, and the cure times can be reduced with the addition of mild heat to the bonded assemblies. This product also provides excellent adhesion and is flexible.

H.B. Fuller 1527B is a black, medium-viscosity, low-odor, good workability RTV silicone. Cures at room temperature when exposed to moisture. Excellent flexibility, adhesive property, electrical insulation, weather resistance, aging resistance, and thermal cycle resistance 1527B passes FDA 21 CFR 177.2600 and is UL-certified.

H.B. Fuller FH8633 is a one-component, thermal-curable adhesive with fast curing at low temperatures, low shrinkage, and high adhesive strength. It can adhere to a variety of substrates and has excellent thermal performance, making it suitable for high-temperature applications. This material also provides high bond strength on various substrates.

H.B. Fuller 1280 is a two-component polyurethane (PU) foam, categorized as a reactive chemistry product. It is specifically designed for battery module encapsulation in electric vehicles. The foam offers lightweight properties, allowing for complete encapsulation of battery cells within the module. This not only provides structural enhancements but also increases impact resistance. H.B. Fuller 1280 is an ideal choice for achieving robust and secure battery module encapsulation in electric vehicle applications.

H.B. Fuller FH8623 is an epoxy adhesive. This adhesive is known for its high-performance characteristics, making it suitable for demanding applications. One of the notable features and benefits of H.B. Fuller FH8623 is its ultra-fast curing property. Additionally, H.B. Fuller FH8623 offers high toughness, providing excellent strength and durability to bonded structures. H.B. Fuller FH8623 is primarily used for structure bonding in module applications.

Tuskbond Infusion 701 - 22L Canister is a specially developed spray adhesive designed to hold reinforcing fibres in place during the infusion process of Resin Transfer Moulding. The super-fast drying time ensures that layers can be built up with minimal time waiting for the adhesive to dry. Tuskbond Infusion 701s unique pebble spray technology covers areas fast and provides a flat bonding surface in seconds.

H.B. Fuller FH4008AB is a two-component epoxy adhesive formulated for potting applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FH4008AB is its excellent isolation resistance. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. Another notable feature of H.B. Fuller FH4008AB is its resistance to aging hardening. This means that the adhesive maintains its performance and properties over time, even under prolonged exposure to various environmental conditions. Furthermore, H.B. Fuller FH4008AB offers a high service temperature, indicating its ability to withstand elevated temperatures without significant degradation.

H.B. Fuller EV Therm 288 is a silicone-free gap filler, formulated exclusively for EV battery environments. This thermal interface material cures at room temperature or is accelerated with heat and provides excellent thermal conductivity, electrical insulation, water resistance, corrosion resistance, and impact resistance properties.

H.B. Fuller EV Protect 5008 is an encapsulant used in adhesives and sealants. It is designed for electrical and electronics applications, specifically for parts and components in batteries and electric vehicles (EVs).

H.B. Fuller EA6033 is a fast UV-cure adhesive. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6033 has shown excellent adhesion and is flexible. It can be used for BGA reinforcement.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

H.B. Fuller FH8801 is a one-part acrylate adhesive that undergoes heat curing. It offers fast curing at low temperatures and provides outstanding bond strength. This adhesive is commonly used for chip bonding in microelectronic, MEMS, and opto-electronic applications. It is especially suitable for in-line production as it has the ability to snap cure. FH8801 is an ideal heat cure acrylic for chip bonding and other electronics applications, including electric motors.

H.B. Fuller FH1425 is a two-part epoxy adhesive specifically formulated for encapsulating and protecting electronics in challenging environments. This epoxy system offers flexibility, making it suitable for applications where the electronics require a high level of protection. Its primary use is for the protection of electronics, including electric motors, where a highly flexible epoxy resin system is required.

H.B. Fuller TL 0587 is a two-component polyurethane potting material with excellent flexibility, suitable for general potting/encapsulation and electric vehicles. It belongs to the polyurethane (PU) chemical family and is a 2K reactive adhesive and encapsulant. H.B. Fuller TL 0587 is categorized under bonding technology and potting compounds within adhesives and sealants technologies.