Products

EternaBond® FGT BC-1121 is a highly compressible PVC foam core encapsulated with a high-tack butyl adhesive/sealant. This flexible material easily conforms to corners and irregular contours. It provides a secure seal that helps protect against water penetration and prevents corrosion and moisture damage. Furthermore, it eliminates the need for cap sealing by gasketing, thereby improving quality.

H.B. Fuller FH8707HF is a black-colored epoxy-based adhesive designed for a wide range of applications in electronic components, printed circuit boards (PCBs), electric motors, and automotive electrical and electronic systems. This heat-curable adhesive offers excellent filling properties, high strength, and good electrical properties. It exhibits improved aging resistance, ensuring long-term durability.

Swift®therm 7297 is a hot melt adhesive used for case and box sealing, as well as fresh or frozen food packaging. The product appears as a yellow solid with an EVA base. It has a medium setting rate, which varies according to the operating temperature, the weight of the adhesive, and the substrate.

H.B. Fuller EV Protect 4006 is a liquid-applied, two-component, flame-retardant, low-density polyurethane foam material designed for the potting and encapsulation of battery cells in EV battery modules. EV Protect 4006 SFR offers battery design engineers the ability to increase the power density of their modules while enhancing safety and protection from thermal propagation. The ultra lightweight nature of the EV Protect 4006 SFR minimizes the weight impact to the battery modules. The semi-structural properties of the material also provide noise, vibration, and harshness benefits to the battery system by unitizing the battery module and absorbing external environmental impacts.

H.B. Fuller EV Protect 5008HD is an encapsulant, designed for electrical and electronics applications, specifically for parts and components in batteries and electric vehicles (EVs).

Swift®bond 2140 + hardener 2111 are two-component polyurethane adhesives. It offers good shelf-life stability and has a fogging resistance of greater than 130°C. The adhesive provides excellent bond strength at temperatures greater than 120°C and demonstrates excellent in-lamp durability. It is designed to exhibit cohesive failure after exposure to various conditions. It has a slow green strength, allowing for extended assembly time. This adhesive is specifically used for headlamp lens and housing bonding in exterior lighting applications.

H.B. Fuller EV Protect 300 is a two-component, low viscosity polyurethane encapsulating system that is designed for potting and encapsulating of battery cells in battery modules. This product offers battery designers the ability to enhance safety and protection from thermal propagation.

H.B. Fuller NP2075VF149 is a reactive hot melt adhesive known for its high performance and high green strength. As a one-component adhesive, it enables efficient manufacturing processes with high speed and low work-in-progress (WIP). It demonstrates excellent thermal stability during the production phase and boasts industry-leading heat resistance when exposed to in-lamp heat. This adhesive is primarily used for headlamp lens and housing bonding and exterior lighting applications.

H.B. Fuller EA6042 is a high-performance, fluorescence, fast UV-cure adhesive and encapsulant. This product has a tack-free surface finish and good electrical insulation performance. It has excellent precision dispensing and jetting performance. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. It has excellent adhesion and is flexible.

H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.

H.B. Fuller FH8732B is a one-part epoxy adhesive that serves as a heat curable potting material. It offers good flow and is effective at filling gaps at room temperature. This epoxy is primarily used as an excellent heat cure encapsulant with low coefficient of thermal expansion (CTA) in electronics applications, specifically for electric motors.

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.

Swift®therm 3055 is a hot melt adhesive with good adhesion to filter media, reduced shrinkage, and good flexibility. It has been developed for the manufacture of air filters as a pleat separator. Filter media is a suitable substrate for this product.

H.B. Fuller FH8805 is a single-component adhesive that cures by heat. It has fast curing at low temperatures and outstanding bond strength. This material is recommended for use with chip bonding in microelectronic, MEMS, and opto-electronic applications. This material is able to snap-cure during in-line production.

H.B. Fuller EA6037 is a fast UV-cure adhesive. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6037 has shown excellent adhesion and is flexible. It can be used for BGA reinforcement.