H.B. Fuller FH8014

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.

Chemical Family: Epoxides, Epoxy & Epoxy Derivatives

Product Type: 1K (1 component) Adhesive, Reactive Adhesive, Underfill Adhesive

Application Area: Chip Scale Packaging (CSP), Electronic Components, Printed Circuit Boards, Wafer Bonding

Features: Excellent Flowability, Fast Cure, High Reliability

Technical Data Sheet
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Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Features and Benefits
  • Fast Flow at Room Temperature
  • Fast cure at moderate temperature minimizing stress on components.
  • Reworkable without damage to the attach pad
  • Pot life extend to 4 days

Applications & Uses

Application Area
Cure Method
Preparation for Material Usage

1. Do not open the package before complete the thawing.
2. Thawing to room temperature (25°C) before using.
3. Seal any remaining material and store immediately at 2-8℃.
4. We do not recommend thawing material more than three times.


Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.


Physical Form
Physical Properties of Cured Material
ValueUnitsTest Method / Conditions
Hardness80.0-ASTM D-2240, Shore D
Elongation at Break2.5%ASTM D-0412
Transition Temperature60.0°C-
Coefficient of Thermal Expansion (Alpha 1)71.7m/m.°CASTM E-831
Coefficient of Thermal Expansion (Aplha 2)249.3m/m.°CASTM E-831
Thermal Conductivity0.21W/m.KASTM D-2214
Water Absorption (at 24 h)0.15%-
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Strength16.3kV/mmASTM D-149
Surface Resistivity1.2 x 10¹⁶ohmASTM D-257
Volume Resistivity4.1 x 10¹⁶Ω.cmASTM D-257
Uncured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.15--
Viscosity (Brookfield CP42, 100 rpm, at 25°C)1560.0cP-
Working Pot Life4.0days-

Technical Details & Test Data

Curing Profile
  • Recommended cure:
    • 30 minutes @ 100℃
    • 15 minutes @ 120℃
    • 10 minutes @ 150℃
  • Curing speed will vary depending on oven temperatures profile efficiency, printed circuit board thickness

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America

Storage & Handling

Shelf Life
6 Months
Storage Conditions

FH8014 is supplied in 30ml/syringes
It should be stored in a 2-8°C refrigerator.
Shelf life is 6 months from date of manufacture.