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H.B. Fuller FH8014

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.

Chemical Family: Epoxides, Epoxy & Epoxy Derivatives

Product Type: 1K (1 component) Adhesive, Reactive Adhesive, Underfill Adhesive

Application Area: Chip Scale Packaging (CSP), Electronic Components, Printed Circuit Boards, Wafer Bonding

Features: Excellent Flowability, Fast Cure, High Reliability

Technical Data Sheet

Enhanced TDS

Identification & Functionality

Chemical Family

Epoxides,

Epoxy & Epoxy Derivatives

Product Type

1K (1 component) Adhesive,

Reactive Adhesive,

Underfill Adhesive

Technologies

Adhesives & Sealants

Product Families

Adhesives & Sealants — Bonding Technology

1K Liquid Reactive Adhesives

Adhesives & Sealants — Functional Adhesives

Underfills

Features & Benefits

Ready-to-Use Product Features

Excellent Flowability,

Fast Cure,

High Reliability

Features and Benefits
  • Fast Flow at Room Temperature
  • Fast cure at moderate temperature minimizing stress on components.
  • Reworkable without damage to the attach pad
  • Pot life extend to 4 days

Applications & Uses

Markets

Consumer Goods,

Electrical & Electronics

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Parts & Components

Printed Circuit Boards (PCBs)

Application Area

Chip Scale Packaging (CSP),

Electronic Components,

Printed Circuit Boards,

Wafer Bonding

Cure Method

Heat Cure

Preparation for Material Usage

1. Do not open the package before complete the thawing.
2. Thawing to room temperature (25°C) before using.
3. Seal any remaining material and store immediately at 2-8℃.
4. We do not recommend thawing material more than three times.

Clean-Up

Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.

Properties

Physical Form

Liquid

Physical Properties of Cured Material
ValueUnitsTest Method / Conditions
Hardness80.0-ASTM D-2240, Shore D
Elongation at Break2.5%ASTM D-0412
Transition Temperature60.0°C-
Coefficient of Thermal Expansion (Alpha 1)71.7m/m.°CASTM E-831
Coefficient of Thermal Expansion (Aplha 2)249.3m/m.°CASTM E-831
Thermal Conductivity0.21W/m.KASTM D-2214
Water Absorption (at 24 h)0.15%-
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Strength16.3kV/mmASTM D-149
Surface Resistivity1.2 x 10¹⁶ohmASTM D-257
Volume Resistivity4.1 x 10¹⁶Ω.cmASTM D-257
Uncured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.15--
Viscosity (Brookfield CP42, 100 rpm, at 25°C)1560.0cP-
Working Pot Life4.0days-

Technical Details & Test Data

Curing Profile
  • Recommended cure:
    • 30 minutes @ 100℃
    • 15 minutes @ 120℃
    • 10 minutes @ 150℃
  • Curing speed will vary depending on oven temperatures profile efficiency, printed circuit board thickness

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America

Storage & Handling

Shelf Life
6 Months
Storage Conditions

FH8014 is supplied in 30ml/syringes
It should be stored in a 2-8°C refrigerator.
Shelf life is 6 months from date of manufacture.