H.B. Fuller FH8009

H.B. Fuller FH8009 is a brown-colored epoxy-based underfill adhesive designed for electronic components, particularly printed circuit boards (PCBs). This ready-to-use product offers excellent flow properties, ensuring smooth and precise application. FH8009 provides high reliability, ensuring secure and long-lasting bonding of components.

Product Type: Underfill Adhesive

Application Area: Electronic Components, Printed Circuit Boards

Chemical Family: Epoxy & Epoxy Derivatives

Features: Excellent Flow Properties, High Reliability

Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Ready-to-Use Product Features

Applications & Uses



Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • North America