H.B. Fuller MP54420

H.B. Fuller MP54420 is a two-part epoxy hybrid adhesive designed for bonding metals and plastics with quick curing at room temperature to a tough, semi-rigid material. It features controlled flow characteristics that provide good wetting without excessive running or dripping, as well as excellent vibration and impact resistance. The product also resists water spray, inorganic acids and bases, and most organic solvents. The recommended 2A:1B volume mix ratio is ideal for use in side-by-side dispensing cartridges and metering, mixing, and dispensing equipment. At room temperature, MP54420 reaches a handle cure within 6–12 hours, but cure time can be accelerated with heat. It's worth noting that cooler temperatures increase work and cure times, and substrate heat-up time should be taken into account.

Chemical Family: Epoxy & Epoxy Derivatives

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive, Hybrid Adhesive, Reactive Adhesive, Structural Adhesive

Compatible Substrates & Surfaces: Ceramic, Metal, Plastics

Features: Excellent Salt Spray Resistance, Excellent Sealing Capability, Excellent Wetting Behaviour, Free Flowing, Good Adhesion, Good Sagging Resistance, Good Toughness, High Impact Resistance, Improved Toughness, Room Temperature Curing, Semi Rigid, Solvent Resistance, Vibration Resistance, Water Resistant

Technical Data Sheet
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Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
General Instructions
  • Surfaces to be bonded must be clean, dry and free of other contaminants.
  • Bring both components to room temperature prior to mixing.
  • Measure out specified amounts of parts A and B and stir (without introducing bubbles) until homogenous or use a static mixing nozzle.
  • Apply the uniform mixture to both surface keeping a thin bond line.
  • Allow to cure while being held in place with light clamping.


Physical Form
Off white liquid
Component A
ValueUnitsTest Method / Conditions
Component B
ValueUnitsTest Method / Conditions
Cured Properties
ValueUnitsTest Method / Conditions
Hardness78.0-ASTM D2240
Tensile Strength62.1MPaASTM D638
Elongation at Break2.8%ASTM D638
Overlap Shear Strength (Aluminum, acid etched at 25°C, at 50% RH)31.0MPaASTM D1002
Operating Temperature- 60 - 150°C-
Dielectric Constant (at 100Hz)4.5-ASTM D150
Dielectric Strength17.3kV/mmASTM D149
Volume Resistivity8 x 10¹⁴Ω.cmASTM D257
Uncured Properties
ValueUnitsTest Method / Conditions
Specific Gravity (Part A)1.15--
Specific Gravity (Part B)1.04--
Specific Gravity (Mix)1.12--
Volume Mix Ratio1:2--
Weight Mix Ratio1900-01-03T07:45:00+00:00--
Pot Life (20 gram)20.0min-
Full Cure (at 23°C)24.0h-
Handling Time Full Cure (at 66°C)2.0h-
Rheological Properties
ValueUnitsTest Method / Conditions
Viscosity (Mixed)35000.0cP-

Packaging & Availability

Regional Availability
  • Latin America
  • North America

Storage & Handling

Shelf Life
12 Months
Storage Conditions
  • Product should be stored in a cool and dry place out of direct sunlight.
  • The shelf life is from date of manufacture.
  • Shelf life is based on the products being stored properly at temperatures between 12°C and 25°C.
  • Exposure to temperatures above 25°C will reduce the shelf life.
  • This product should not be frozen.