H.B. Fuller MP5405NS

H.B. Fuller MP5405NS is a two-part unfilled epoxy adhesive that is designed for high-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid material and has a thixotropic paste consistency to prevent running and sagging. This product has good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was specially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 20 - 30 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

Chemical Family: Epoxy & Epoxy Derivatives

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive, Reactive Adhesive, Structural Adhesive

Compatible Substrates & Surfaces: Ceramic, Elastomers & Rubbers, Glass, Metal, Plastics

Features: Excellent Salt Spray Resistance, Free Flowing, Good Adhesion, Good Sagging Resistance, Good Toughness, Room Temperature Curing, Solvent Resistance, Thixotropic

Technical Data Sheet
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Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
General Instructions
  • Surfaces to be bonded must be clean, dry and free of other contaminants.
  • Bring both components to room temperature prior to mixing.
  • Measure out specified amounts of parts A and B and stir (without introducing bubbles) until homogenous or use a static mixing nozzle.
  • Apply the uniform mixture to both surfaces.
  • Allow to cure while being held in place with light clamping.


Physical Form
Translucent/white viscous paste
Component A
ValueUnitsTest Method / Conditions
Component B
ValueUnitsTest Method / Conditions
Cured Properties
ValueUnitsTest Method / Conditions
Hardness80.0-ASTM D2240
Tensile Strength48.3MPaASTM D638
Elongation at Break3 - 5%ASTM D638
Overlap Shear Strength (Aluminum, acid etched at 25°C, at 50% RH)19.3MPaASTM D1002
Operating Temperature- 40 - 130°C-
Dielectric Constant (at 100Hz)4.5-ASTM D150
Dielectric Strength16.1kV/mmASTM D149
Volume Resistivity8 x 10¹⁴Ω.cmASTM D257
Uncured Properties
ValueUnitsTest Method / Conditions
Specific Gravity (Part A)1.17--
Specific Gravity (Part B)1.15--
Specific Gravity (Mix)1.16--
Volume Mix Ratio1:1--
Weight Mix Ratio1:1--
Pot Life (20 gram)3 - 5min-
Handling Time Full Cure (at 23°C)20 - 30min-
Handling Time Full Cure (at 66°C)24.0h-
Rheological Properties
ValueUnitsTest Method / Conditions
Viscosity (Mixed)1500000.0cP-

Packaging & Availability

Regional Availability
  • Latin America
  • North America

Storage & Handling

Shelf Life
12 Months
Storage Conditions
  • Product should be stored in a cool and dry place out of direct sunlight.
  • The shelf life is from date of manufacture.
  • Shelf life is based on the products being stored properly at temperatures between 12°C and 25°C.
  • Exposure to temperatures above 25°C will reduce the shelf life.
  • This product should not be frozen.