Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Key Attributes
- Fast initial set strength, building 50% of its maximum cured strength within the 3-5 minutes after bond allowing short wait for pressure testing.
- Rapid Dimensional Stability
- Good low temperature flexibility
- One component requires no mixing
- Low outgassing
- Excellent manufacturing thermal stability
Applications & Uses
- Compatible Substrates & Surfaces
- Cure Method
- Application Instructions
- H.B. Fuller EV Bond 720 is designed to be used with heated platen-style melting machine that transfers material from pails or drums to a nozzle enough to form a bead and dispense into the housing.
- Substrate surface must be clean, dry, and free from oils and dust.
- Non-polar substrates must be surface treated (e.g. plasma treated) prior to adhesive application.
- If the equipment is to be shut down for extended periods of time, we suggest purging the system with H.B. Fuller Swift®Clean 9037.
Properties
- Color (Properties)
- Physical Form
- Cured Properties
Value Units Test Method / Conditions Hardness 90 - 95 - ASTM D2240, Shore A Ultimate Tensile Strength 18.0 MPa ASTM D638, Type V Elongation (at Break) 150 - 200 % ASTM D638, Type V Young's Modulus 200 - 250 MPa ASTM D638, Type V Lap Shear Strength (at 23°C) 7.0 MPa ASTM D3163 (Polycarbonate to Polycarbonate) Lap Shear Strength (at -30°C) 1.85 MPa ASTM D3163 (Polycarbonate to Polycarbonate) Lap Shear Strength (at 120°C) 1.89 MPa ASTM D3163 (Polycarbonate to Polycarbonate) - Processing Properties
Value Units Test Method / Conditions Application Temperature 160 - 180 °C - Viscosity (at 163°C, 10 rpm) 13,000 - 18,000 mPa.s ASTM D1084, Spindle 27 Specific Gravity 1.16 g/cm³ HBF Internal: TMHM-017 Open Time 90.0 seconds ASTM D3163, Adhesive Bead Clamping/Fixture Time 3 - 4 minutes HBF Internal Over-Lap Shear Initial Strength (at 3 minutes) 1.3 MPa ASTM D3163 (Polycarbonate to Polycarbonate)
Technical Details & Test Data
- Curing Profile
Under standard conditions (23°C, 50% RH), full cure will take approximately 14 days. Any deviation from standard conditions will change the cure rate. Additionally, cure rates and completeness of cure will vary with adhesive thickness and the substrate's moisture permeability.
Packaging & Availability
Storage & Handling
- Shelf Life
- 12 months
- Storage Conditions
- Product should be stored in a clean and dry condition in an original and unopened container between 10°C and 35°C.
- Shelf Life: 12 months from date of manufacture, in original unopened container at 23°C.