Products

Cyberbond CB 5600 is a cyanoacrylate with low odor, low blooming (whitening effect), and low outgassing characteristics. These very positive properties are accompanied by lower strength features when compared to cyanoacrylates based on ethyl ester. CB 5600 is a high-viscosity grade with certain gap-filling properties.

H.B. Fuller FH8805 is a single-component adhesive that cures by heat. It has fast curing at low temperatures and outstanding bond strength. This material is recommended for use with chip bonding in microelectronic, MEMS, and opto-electronic applications. This material is able to snap-cure during in-line production.

Cyberbond CB 5500 is a cyanoacrylate with low odor, low blooming (whitening effect), and low outgassing characteristics. These very positive properties unfortunately go along with lower strength features compared to the ethyl ester-based cyanoacrylates. CB 5500 is a very low-viscosity grade with wicking properties.

H.B. Fuller EV Bond 720 is designed to set quickly and strengthen within 3-4 minutes. Fully moisture-cured material displays excellent high temperature strength, tested up to 120°C. Rapid shipment of bonded parts is possible, as H.B. Fuller EV Bond 720 will not flow or expulse at 120°C, preserving bonded geometry at high temperatures before fully moisture-cured. This patented reactive hot melt moisture curing material is a one component polyurethane, 100% solid adhesive. Excellent adhesion strength is achieved within 10 seconds to 3 minutes after dispensing. This product has aggressive hot tack and cures in the presence of moisture into a tough bond. It works well in bonding various plastics, woods, metals, and primed glass substrates.

H.B. Fuller FH3911 A/B is a two-component adhesive and encapsulant widely used in casting applications. It belongs to the urethane chemical family and exhibits a transparent color. This product offers various features and benefits, including biocompatibility, clarity, low outgassing, low viscosity, and optical clarity. It is suitable for multiple application areas, such as potting compounds in electrical and electronics packaging and assembly, as well as printed circuit boards (PCBs).

Bacon Adhesives LCA-4 is a reactive-chemistry epoxy adhesive that meets NASA's outgassing requirements. It is known as "gyro-grade" and offers excellent chemical resistance, good dimensional stability, and a low coefficient of thermal expansion. This adhesive is commonly used for hermetic sealing of metal, ceramic, glass, and other substrates in space exploration applications.

H.B. Fuller FH8801C is a fast-curing, single-component, electrically conductive adhesive designed for chip bonding in microelectronic, MEMS, and opto-electronic applications. This heat-curable material offers outstanding bond strength and snap cure during in-line production, making it ideal for automated assembly processes.

Bacon Adhesives P-182 is a highly filled, high-performance epoxy adhesive. It is a reactive-chemistry epoxy that exhibits low thermal expansion and excellent dimensional stability. This adhesive meets NASA's outgassing requirements and is non-magnetic. With its high strength and high modulus, Bacon Adhesives P-182 is ideal for high reliability and high-performance applications in space exploration.

Bacon Adhesives Thermally Conductive 442 is a thermally conductive polyurethane adhesive with low outgassing properties. It is specifically designed for bonding glass diodes or other stress-sensitive components. This adhesive offers excellent electrical properties and high flexibility. It is well-suited for circuit board assembly and protection in space exploration applications.

Cyberbond CB 5508 is a cyanoacrylate with low odor, low blooming (whitening effect), and low outgoing characteristics. These very positive properties go along with their lower strength compared to the ethyl ester-based cyanoacrylates. CB 5008 is a medium viscosity grade with general purpose properties in this range.