Weld Mount AT-6030 is a cutting-edge two-component structural adhesive featuring a 10:1 mix ratio. Unlock exceptional bonding prowess for metals, carbon fiber, composites, and plastics. Experience streamlined bonding—no priming required for most metals. Crafted with precision for the transportation sector, it ensures minimal read-through on display surfaces. With effortless surface prep, primerless metal bonding, and reduced read-through, AT-6030 excels in diverse assembly operations.

Product Type: 2K (2 component) Adhesive, Reactive Adhesive, Structural Adhesive

Compatible Substrates & Surfaces: Acrylic, Acrylonitrile Butadiene Styrene (ABS), Aluminum, Carbon Fiber, Composites, Epoxies, Fiberglass, Gelcoat, Metal, Phenolics, Plastics, Polybutylene Terephthalate (PBT), Polycarbonate (PC), Polyether Ether Ketone (PEEK), Polyethylene Terephthalate (PET), Polyphenylene Ether (PPE), Polyvinyl Chloride (PVC), Sheet Molding Compound (SMC), Stainless Steel, Steel, Ultra-High-Molecular-Weight Polyethylene (UHMWPE)

Features: Easy To Apply, Excellent Strength, Excellent Substrate Adhesion, Good Sagging Resistance, High Impact Resistance, Primerless, Room Temperature Curing, Weather Resistant

Technical Data Sheet

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Identification & Functionality

Features & Benefits

Equipment Features
Ready-to-Use Product Features
Product Highlights
  • Weld Mount AT-6030 adhesive is a two-component, 10:1 mix ratio structural adhesive with outstanding adhesion for bonding metals, carbon fiber, composites and most plastics.
  • Most metals can be bonded without priming.
  • This advanced product is designed to meet specific requirements of the transportation industry, including reduced read through on show surfaces.
  • The combination of minimum surface preparation, primerless metal bonding and low read through makes AT-6030 ideal for a variety of assembly operations.
  • AT-6030 is packaged in 40ML cartridges for use with our AT-300 dispensing gun and AT-650 mixing tips.
  • Primerless metal bonding
  • Reduced read through
  • Good environmental resistance
  • Non-sag formulation
  • Excellent strength
  • Impact resistant
  • 100% reactive
  • Room temperature cure
  • Easily applied
  • AT-6030 bonds to:
    • Metals: Aluminum, Steel, Stainless steel, Coated metals
    • Thermo sets: Fiberglass, Phenolics, Gel coats, Epoxy, Liquid molding resins, SMC
    • Thermo plastics: Acrylics, ABS, Polycarbonates, PVC's, Styrene's, Peek's, PBT Blends, PET Blends
  • Substrate : Metal Carbon
  • Best for Metal Bonding 10:1 cartridge
  • Dispense Gun : AT-301
  • Static Mix Tip : AT-650 3.5" Mix Tip

Applications & Uses

Compatible Substrates & Surfaces
Cleaning Information
  • Adhesive components and mixed adhesive should beremoved from surfaces with a suitable industrialsolvent or cleaner before the mixed adhesive cures.
  • Once the adhesive cures, soaking in a strong solventor paint remover will be required to soften theadhesive for removal.
  • Any clean-up of the bondedassembly using industrial solvents is notrecommended as it could affect the cure.
Surface Preparation
  • The need for surface preparation must be determined bycomparative testing of prepared and unprepared substratesto assure that unprepared bonding is equivalent to oracceptable for the application relative to prepared bonding.
  • Initial bonding tests must be followed up with simulated oractual durability tests to assure that surface conditions do not lead to degradation of the bond over time under service conditions.
  • Subsequent changes in substrates or bonding conditions will require re-testing.
  • Prepare metals forbonding by removing dust, loose scale, rust, and other surface residue including oil and grease.
  • For maximum bond strength on steel, abrade surface prior to bonding.
Substrate Suitability
  • The user must determine the suitability of a selectedadhesive for a given substrate and application.
  • Associated Technologies strongly recommends laboratory, shop andend-use testing that simulates the actual manufacturingand end-use environment.
  • Most thermoplastics can bebonded with no surface preparation other than a dry wipeor air blow-off.
  • If contamination is visible or suspected,wipe with alcohol prior to bonding. Polyolefins,thermoplastic polyesters, fluorocarbon plastics and otherlow surface energy plastics are generally not bondable.
  • Testing is required on thermoset plastics because of thewide variations in compositions
Curing
  • Open working time is the approximate time after mixing components A and B, depending on bonding conditions, that the adhesive remains fluid andbondable.
  • Fixture time is the approximate time aftermixing components A and B required for the adhesiveto react the partial state of cure necessary to allowcareful movement, unclamping or de-molding of assembled parts.
  • Parts can generally be put in servicewhen 80 percent of full strength is developed.
  • The time to achieve 80% cure is approximately 2-3 times thatrequired for fixturing.
  • The working and fixture timespresented in this bulletin are based on laboratory tests performed at 75°F/24°C.
  • Higher temperatures speedthe curing reaction and reduce open working time.
Mixing and Application
  • EXOTHERM: The chemical curing reaction that occurswhen components A and B are mixed generates heat.
  • The amount of heat generated is controlled by themass and thickness of the mixed product.
  • Large masses over 1/2 inch thick can develop heat in excessof 250°F/121°C and can generate harmful, flammablevapors.
  • Large curing masses should be carefully moved to a well-ventilated area where the chance ofpersonal contact is minimized.

Properties

Physical Properties of Cured Material
ValueUnitsTest Method / Conditions
Shear Strength (Alum)2800.0psi-
Max Tensile Elongation100 - 125%-
Modulus30,000 - 40,000psi-
Lap Shear Strength2,500 - 2,800psi-
Service Temperature- 40 to 180°F-
Working Time (Open)5 to 6Minutes-
Fixture Time10 to12Minutes-
Handling Strength (for 80% overall strength)45.0Minutes-
Uncured Properties
ValueUnitsTest Method / Conditions
Viscosity (Mixed, at 25°C)200000.0cps-
Specific Gravity (at 20°C)1.02--
Flash Point51.0°FCOC Method
Clean Up SolventsMEK, Acetone--
Effect of Temperature
  • AT-6030 is best used at temperatures between 65° F and 80° F.
  • Temperature below 65° F will slow the cure speed of the material and the viscosities will be higher.
  • Temperatures above 80° F will cause the material tocure faster and the viscosities will be lower.
  • For consistent dispensing maintain temperature as listed above.

Packaging & Availability

Packaging Type
Packaging Information

AT-6030 is conveniently packaged in 40 Ml cartridges.

Storage & Handling

Shelf Life
6 months
Storage Conditions
  • The shelf life of components A and B in unopened containers is approximately six months from the date the product is shipped from
  • Associated Technologies facility. Shelf life is based on steady state storage between 55°F and 80°F (13°C and 27°C).
  • Exposure, intermittent or prolonged, above 80°F (27°C) will result in a reduction of the stated shelf life.
  • Exposures above 100 ºF (38 ºC) during shipping or storage can quickly degrade component B in cartridges or bulk containers, and must be prevented.
  • Shelf life of both components can be extended by air-conditioned or refrigerated storage between 50°F and 65°F (10°C and 18°C).
  • Keep from freezing.