H.B. Fuller FH8732B

H.B. Fuller FH8732B is a one-part epoxy adhesive that serves as a heat curable potting material. It offers good flow and is effective at filling gaps at room temperature. This epoxy is primarily used as an excellent heat cure encapsulant with low coefficient of thermal expansion (CTA) in electronics applications, specifically for electric motors.

Product Type: 1K (1 component) Adhesive, Encapsulant, Potting Compound, Reactive Adhesive

Application Area: Electric Motors, Electronic Components

Chemical Family: Epoxy & Epoxy Derivatives

Features: Good Gap Filling Capabilities, High Flowability

Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Cure Method

Packaging & Availability

Regional Availability
  • Asia Pacific
  • Latin America
  • North America