Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Features and Benefits
- Conductive (thermal and electrical) post cure
- One component requires no mixing
- Fast curing
- High bond strength on a variety of substrates
- Suitable for fine pattern dispensing
- Excellent thermal performance
- Low outgassing
- High thermal stability
- Low Stress
- Jettable with high consistancy
- Design for high speed dispensing
Applications & Uses
- Applications
- Application Area
- Application Method
- Cure Method
Properties
- Color
- Electrical Properties
- Uncured Properties
- Typical Performance Properties
| Value | Units | Test Method / Conditions | |
| Volume Resistivity | max. 0.0004 | Ω.cm | ASTM D-257 |
| Value | Units | Test Method / Conditions | |
| Viscosity (at 25 °C) | 8300.0 | mPa.s | — |
| Thixotropic Index | 3.9 | — | — |
| Pot Life | 24.0 | h | — |
| Density | 4.4 | g/cc | — |
| Value | Units | Test Method / Conditions | |
| Glass Transition Temperature | 120.0 | °C | — |
| Co-efficient of Thermal Expansion (Alpha 1) | 70.0 | ppm/°C | TMA |
| Co-efficient of Thermal Expansion (Alpha 2) | 134.0 | ppm/°C | TMA |
| Weight Loss (at 110°C) | 0.3 | % | — |
| Weight Loss (at 288°C) | 0.75 | % | — |
| Die Shear Strength (2x2mm silicon die, solder mask FR₄) | 22.0 | MPa | — |
| Die Shear Strength (2x2mm silicon die, solder mask FR₄, 3X Pb free reflow) | 38.8 | MPa | — |
| Die Shear Strength (2x2mm silicon die, solder mask FR₄, 85°C, 85%RH, 240hr) | 33.1 | MPa | — |
| Die Shear Strength (2x2mm silicon die, bare Cu substrate) | 28.8 | MPa | — |
| Die Shear Strength (2x2mm silicon die, bare FR₄ substrate) | 24.7 | MPa | — |
Technical Details & Test Data
- Recommended Cure
- 110°C for 90 seconds
Packaging & Availability
- Regional Availability
- Available Packaging
- 10cc and 30cc syringes
Storage & Handling
- Shelf Life
- 12 Months
- Storage Conditions
FH8801C should be sealed and stored in the original container at -40 °C.