H.B. Fuller FH8801C

H.B. Fuller FH8801C is a fast-curing, single-component, electrically conductive adhesive designed for chip bonding in microelectronic, MEMS, and opto-electronic applications. This heat-curable material offers outstanding bond strength and snap cure during in-line production, making it ideal for automated assembly processes.

Chemical Family: Acrylics & Acrylates

Product Type: 1K (1 component) Adhesive, Conductive Adhesive, Reactive Adhesive

Application Area: Chip Module, Electric Motors, Electric Vehicle (EV), Microelectromechanical Systems (MEMS) Applications, Optoelectronics Devices

Application Method: Injection

Features: Electrically Conductive, Fast Curing, Good Bonding Strength, Good Thermal Stability, High Consistency, Low Outgassing, Low Temperature Curing, Thermally Conductive

Technical Data Sheet
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Enhanced TDS

Identification & Functionality

Chemical Family

Features & Benefits

Features and Benefits
  • Conductive (thermal and electrical) post cure
  • One component requires no mixing
  • Fast curing
  • High bond strength on a variety of substrates
  • Suitable for fine pattern dispensing
  • Excellent thermal performance
  • Low outgassing
  • High thermal stability
  • Low Stress
  • Jettable with high consistancy
  • Design for high speed dispensing

Applications & Uses

Application Method
Cure Method


Electrical Properties
ValueUnitsTest Method / Conditions
Volume Resistivitymax. 0.0004Ω.cmASTM D-257
Uncured Properties
ValueUnitsTest Method / Conditions
Viscosity (at 25 °C)8300.0mPa.s-
Thixotropic Index3.9--
Pot Life24.0h-
Typical Performance Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature120.0°C-
Co-efficient of Thermal Expansion (Alpha 1)70.0ppm/°CTMA
Co-efficient of Thermal Expansion (Alpha 2)134.0ppm/°CTMA
Weight Loss (at 110°C)0.3%-
Weight Loss (at 288°C)0.75%-
Die Shear Strength (2x2mm silicon die, solder mask FR₄)22.0MPa-
Die Shear Strength (2x2mm silicon die, solder mask FR₄, 3X Pb free reflow)38.8MPa-
Die Shear Strength (2x2mm silicon die, solder mask FR₄, 85°C, 85%RH, 240hr)33.1MPa-
Die Shear Strength (2x2mm silicon die, bare Cu substrate)28.8MPa-
Die Shear Strength (2x2mm silicon die, bare FR₄ substrate)24.7MPa-

Technical Details & Test Data

Recommended Cure
  • 110°C for 90 seconds

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America
Available Packaging
  • 10cc and 30cc syringes

Storage & Handling

Shelf Life
12 Months
Storage Conditions

FH8801C should be sealed and stored in the original container at -40 °C.