Enhanced TDS
Identification & Functionality
Features & Benefits
- Ready-to-Use Product Features
- Features and Benefits
- Conductive (thermal and electrical) post cure
- One component requires no mixing
- Fast curing
- High bond strength on a variety of substrates
- Suitable for fine pattern dispensing
- Excellent thermal performance
- Low outgassing
- High thermal stability
- Low Stress
- Jettable with high consistancy
- Design for high speed dispensing
Applications & Uses
- Markets
- Applications
- Application Area
- Application Method
- Cure Method
Properties
- Color
- Electrical Properties
Value Units Test Method / Conditions Volume Resistivity max. 0.0004 Ω.cm ASTM D-257 - Uncured Properties
Value Units Test Method / Conditions Viscosity (at 25 °C) 8300.0 mPa.s - Thixotropic Index 3.9 - - Pot Life 24.0 h - Density 4.4 g/cc - - Typical Performance Properties
Value Units Test Method / Conditions Glass Transition Temperature 120.0 °C - Co-efficient of Thermal Expansion (Alpha 1) 70.0 ppm/°C TMA Co-efficient of Thermal Expansion (Alpha 2) 134.0 ppm/°C TMA Weight Loss (at 110°C) 0.3 % - Weight Loss (at 288°C) 0.75 % - Die Shear Strength (2x2mm silicon die, solder mask FR₄) 22.0 MPa - Die Shear Strength (2x2mm silicon die, solder mask FR₄, 3X Pb free reflow) 38.8 MPa - Die Shear Strength (2x2mm silicon die, solder mask FR₄, 85°C, 85%RH, 240hr) 33.1 MPa - Die Shear Strength (2x2mm silicon die, bare Cu substrate) 28.8 MPa - Die Shear Strength (2x2mm silicon die, bare FR₄ substrate) 24.7 MPa -
Technical Details & Test Data
- Recommended Cure
- 110°C for 90 seconds
Packaging & Availability
- Regional Availability
- Available Packaging
- 10cc and 30cc syringes
Storage & Handling
- Shelf Life
- 12 Months
- Storage Conditions
FH8801C should be sealed and stored in the original container at -40 °C.