H.B. Fuller FH8801C

H.B. Fuller FH8801C is a fast-curing, single-component, electrically conductive adhesive designed for chip bonding in microelectronic, MEMS, and opto-electronic applications. This heat-curable material offers outstanding bond strength and snap cure during in-line production, making it ideal for automated assembly processes.

Chemical FamilyAcrylics & Acrylates

Product Type1K (1 component) Adhesive, Conductive Adhesive, Reactive Adhesive

Application AreaChip Module, Electric Motors, Electric Vehicle (EV), Microelectromechanical Systems (MEMS) Applications, Optoelectronics Devices

Application MethodInjection

FeaturesElectrically Conductive, Fast Curing, Good Bonding Strength, Good Thermal Stability, High Consistency, Low Outgassing, Low Temperature Curing, Thermally Conductive

Technical Data Sheet

Enhanced TDS

Identification & Functionality

Chemical Family

Features & Benefits

Features and Benefits
  • Conductive (thermal and electrical) post cure
  • One component requires no mixing
  • Fast curing
  • High bond strength on a variety of substrates
  • Suitable for fine pattern dispensing
  • Excellent thermal performance
  • Low outgassing
  • High thermal stability
  • Low Stress
  • Jettable with high consistancy
  • Design for high speed dispensing

Applications & Uses

Application Method
Cure Method

Properties

Color
Electrical Properties
ValueUnitsTest Method / Conditions
Volume Resistivitymax. 0.0004Ω.cmASTM D-257
Uncured Properties
ValueUnitsTest Method / Conditions
Viscosity (at 25 °C)8300.0mPa.s
Thixotropic Index3.9
Pot Life24.0h
Density4.4g/cc
Typical Performance Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature120.0°C
Co-efficient of Thermal Expansion (Alpha 1)70.0ppm/°CTMA
Co-efficient of Thermal Expansion (Alpha 2)134.0ppm/°CTMA
Weight Loss (at 110°C)0.3%
Weight Loss (at 288°C)0.75%
Die Shear Strength (2x2mm silicon die, solder mask FR₄)22.0MPa
Die Shear Strength (2x2mm silicon die, solder mask FR₄, 3X Pb free reflow)38.8MPa
Die Shear Strength (2x2mm silicon die, solder mask FR₄, 85°C, 85%RH, 240hr)33.1MPa
Die Shear Strength (2x2mm silicon die, bare Cu substrate)28.8MPa
Die Shear Strength (2x2mm silicon die, bare FR₄ substrate)24.7MPa

Technical Details & Test Data

Recommended Cure
  • 110°C for 90 seconds

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America
Available Packaging
  • 10cc and 30cc syringes

Storage & Handling

Shelf Life
12 Months
Storage Conditions

FH8801C should be sealed and stored in the original container at -40 °C.