Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- High initial strength.
- High thermal stability
- Good flexibility after complete curing.
Applications & Uses
- Markets
- Compatible Substrates & Surfaces
- Usage Information
- Application Procedure and Type of Applicator: Drum, pail and bag unloaders in combination with nozzle-, coating roller- and/or screen printing systems.
- Coverage: dependent on application, 10-100 g/m2 depending on application system and substrate.
- Cleaning Agent: IPATHERM®-Reiniger 13 for uncured adhesive. Cured adhesive can only be removed mechanically.
- Application Information
Pretreatment of Bonding Surfaces
- Bonding surfaces have to be clean, dry and free of grease and oil.
- Polyolefin materials have to be corona-pretreated or flame-treated.
Preparation
- Drum unloader, heating plate, conveyor pump and applicator gun can, as a rule, be set to different temperatures.
- Excessive heat may cause decomposition of the adhesive.
- Depending on the construction of the equipment, a temperature of up to 160°C is sufficient for the heating plate and the conveyor pump.
- Due to the short operation time, the application equipment may be run at temperatures of up to 160°C.
- For tank melters only protective gasses with < 5ppm humidity should be used.
- Positive results have been achieved with nitrogen.
- Please take care of that packages are used immediately after opening in order to prevent possible reactions with moisture
Adhesive Application
- RAPIDEX® NP 2075 LT is either applied in beads or tapes or as a sheet onto one of the bonding surfaces.
- Bonding is carried out immediately upon application.
Special Attention
- Final cure is achieved by reaction with ambient moisture or moisture from the substrate.
- Curing time depends on the access of humidity to the bonding seam, i.e. the humidity of the substrate, substrate permeability, adhesive film thickness, relative air humidity and ambient temperature.
- Average curing time for bonding onto wooden materials at a temperature of 20°C and relative humidity of 65% amounts to up to 3-4 days.
- If large surfaces and/or impermeable materials are bonded under unfavorable climatic conditions, the curing time may be considerably longer.
Properties
- Specifications
| Value | Units | Test Method / Conditions | |
| Density (at 20°C) | approx. 1.02 | g/cm³ | — |
| Viscosity (at 120°C) | approx. 45000 | mPa.s | — |
| Viscosity (at 150°C) | approx. 16000 | mPa.s | — |
| Open Time | 180.0 | Seconds | — |
| Premelting Temperature | approx. 160 | °C | — |
| Application Temperature | approx. 120 - 140 | °C | — |
| Coverage Range | 10 - 100 | g/m² | — |
Packaging & Availability
- Packaging Type
Storage & Handling
- Shelf Life
- 6 months (in unopened pails and drums), 12 (months in cartridges)