Products

H.B. Fuller FH8801C is a fast-curing, single-component, electrically conductive adhesive designed for chip bonding in microelectronic, MEMS, and opto-electronic applications. This heat-curable material offers outstanding bond strength and snap cure during in-line production, making it ideal for automated assembly processes.

H.B. Fuller PHOTOCAP® 3610 is an ultra-fast cure and PID resistant thermoset polyolefin encapsulant with HLT™ higher light transmission in the UV wavelength region to allow greater power generation with blue light-sensitive photovoltaic devices. It has a low MVTR, a short lamination cycle, and excellent light transmission with no acetic acid concerns.

H.B. Fuller FH8511 is a 2K epoxy adhesive known for its excellent impact strength and toughness. It is a versatile adhesive suitable for bonding a wide range of materials commonly found in portable devices. The adhesive offers fast setting properties, allowing for efficient assembly and production processes. The adhesive is formulated for structure bonding applications, providing strong and durable connections between components. H.B. Fuller FH8511 is commonly used in the manufacturing of portable devices where structural bonding is critical for their performance and durability.

Tonsan® EP843 is an epoxy adhesive known for its high strength and heat resistance, capable of withstanding temperatures up to 150°C in the long term and 180°C in the short term. It has a high viscosity, making it suitable for potting bonding applications where thixotropic properties are desired, preventing flow on vertical surfaces. This adhesive is specifically designed for bonding metal and other parts in high-temperature and harsh conditions, making it ideal for use in the electric vehicle industry.

PVC TrimWelder™ Laminating Grade is a low-viscosity, solvent-free structural adhesive system designed for laminating unmilled PVC sheets and boards. Its lower viscosity provides greater flow-out with less clamping pressure to insure a thin, void-free bond. Cured performance shows excellent adhesion and bond strength in excess of the PVC. This material can withstand thermal cycling and shock loading between dissimilar materials. PVC TrimWelder™ Laminating Grade is ready to handle in 45 minutes and may be cut and machined in 1 hour.

H.B. Fuller UR4515GF is a two-component polyurethane adhesive specifically designed for the structural bonding of metals and plastics. This product offers high lap shear strength, good thixotropy for easy application, and a good work life. It has a 1:1 mix ratio by volume and is designed for easy use with automated dispense systems.

H.B. Fuller FH8513 is a 2K epoxy adhesive developed for structure bonding in portable devices. One notable advantage of FH8513 is its design for device assembly. It is formulated to provide reliable and durable bonds when joining various components in portable devices. It also offers a long open time, which refers to the duration during which the adhesive remains workable after mixing its two components. In addition, H.B. Fuller FH8513 exhibits high toughness, meaning it can withstand mechanical stresses and impacts without compromising the bond strength.

MP-55305 is a high-performance, two-part methacrylate adhesive engineered to bond a wide range of plastics, metals, and composite assemblies. It offers outstanding bond strength, is extremely durable, and has excellent impact and weathering properties. H.B. Fuller MP55305 greatly increases the reliability of finished assemblies with its exceptional flexibility, ability to withstand extreme temperature fluctuations and thermal cycling, and resistance to a wide range of chemicals and environmental conditions. It offers exceptional bonding for a wide range of substrates.

H.B. Fuller PHOTOCAP® 3650 is an ultrafast-curing, PID-resistant thermoset polyolefin encapsulant with enhanced UV protection to ensure backsheet longevity. It has a low MVTR (moisture vapor transmission rate), a short lamination cycle, and excellent light transmission with no acetic acid concerns.

H.B. Fuller FH8050 is an electrically insulating, one-component epoxy encapsulant and bonding material. It is specifically designed to cure during lead-free solder reflow while allowing self-alignment of IC components. This corner bonding material improves the mechanical reliability of hand-held devices.

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller MP54190 is a two-part mineral-filled epoxy adhesive for bonding metals and plastics. It cures at room temperature to a semi-flexible material with good wetting properties for self-leveling and air release. It provides excellent vibration and impact resistance and good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. With a 1:1 volume mix ratio, it's suitable for use with dispensing cartridges and metering, mixing, and dispensing equipment. At room temperature, the adhesive reaches a handle cure within 16–24 hours, but heat can accelerate curing, with typical times and temperatures ranging from 2 hours at 65°C to 20 minutes at 100°C. Work and cure times will increase at cooler temperatures.

H.B. Fuller MP5405NS is a two-part unfilled epoxy adhesive that is designed for high-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid material and has a thixotropic paste consistency to prevent running and sagging. This product has good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was specially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 20 - 30 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

H.B. Fuller FH7011 is a 1K acrylate anaerobic adhesive specifically designed for metal structure bonding. This adhesive is a one-part acrylic anaerobic adhesive used for bonding ferrites to electro-plated materials in electric motors. Its main uses include structure bonding and serving as an anaerobic adhesive for electric motor bonding in portable devices and electric motors.