Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Applications
- Compatible Substrates & Surfaces
- Cure Method
- Application Instructions
Curing Performance:
- The rate of cure will depend on environmental conditions and the substrates used. The gap of the bond line will affect set speed. Smaller gaps tend to increase set speed. Activators may be applied to further improve set speed, but may also impair overall adhesive performance.
General Instructions:
- Surfaces to be bonded should be clean and dry and free of grease. Product should be applied in enough quantity to fill all engaged threads or gap.
- The product performs best in thin bond gaps. Very large gaps may create gaps that will affect the cure speed and overall strength. Good contact is essential.
- It is recommended to confirm compatibility of the product with all substrates prior to use. This product is not recommended for use with strong oxidizing materials.
- Where aqueous washing systems are used to clean the surfaces before bonding, these aqueous washes can affect the cure and performance of the adhesive.
- This product is not normally recommended for use on plastics, users must check compatibility of the product with such substrates.
Properties
- Physical Form
- Appearance
- Green
- Chemical Resistance
- Cured Properties
- Uncured Properties
| Value | Units | Test Method / Conditions | |
| Room Temperature Strength (50% Water/50% Glycol, at 87°C, 1000h) | 80.0 | % | - |
| Room Temperature Strength (Unleaded gasoline, at 22°C, 1000 h) | 85.0 | % | - |
| Room Temperature Strength (Motor oil, at 125°C, 1000 h) | 100.0 | % | - |
| Value | Units | Test Method / Conditions | |
| Coefficient of Thermal Expansion | 80.0 | ppm/K | ASTM D696 |
| Service Temperature | 55 - 150 | °C | - |
| Pin/Collar Shear Strength | 20 - 32 | N-m | ISO 10123 |
| Thermal Conductivity | 0.1 | W/m.K | ASTM C177 |
| Specific Heat | 0.3 | kJ/kgK | - |
| Cure Speed (at 5°C, 25% of room temperature strength) | 4.0 | h | - |
| Cure Speed (at 40°C, 25% of room temperature strength) | 7.0 | min | - |
| Cure Speed (at 5°C, 50% of room temperature strength) | 8.0 | h | - |
| Cure Speed (at 40°C, 50% of room temperature strength) | 12.0 | min | - |
| Cure Speed (at 5°C, 100% of room temperature strength) | 72.0 | h | - |
| Cure Speed (at 40°C, 100% of room temperature strength) | 3 - 72 | h | - |
| Cure Speed on Steel (25% of room temperature strength) | 15.0 | min | - |
| Cure Speed on Steel (50% of room temperature strength) | 30.0 | min | - |
| Cure Speed on Steel (100% of room temperature strength) | 6 - 72 | h | - |
| Cure Speed on Aluminium (25% of room temperature strength) | 2.0 | h | - |
| Cure Speed on Aluminium (50% of room temperature strength) | 15.0 | h | - |
| Cure Speed for 0.05mm Gap Size (25% of room temperature strength) | 20.0 | min | - |
| Cure Speed for 0.05mm Gap Size (50% of room temperature strength) | 40.0 | min | - |
| Cure Speed for 0.05mm Gap Size (100% of room temperature strength) | 15 - 72 | h | - |
| Cure Speed for 0.25mm Gap Size (25% of room temperature strength) | 20.0 | h | - |
| Cure Speed for 0.25mm Gap Size (50% of room temperature strength) | 48.0 | h | - |
| Value | Units | Test Method / Conditions | |
| Viscosity (at spindle 1, 20 rpm) | 100 - 150 | cP | Brookfield |
| Specific Gravity | 1.1 | - | - |
| Flash Point | min. 93 | °C | - |
| Set Time (Steel) | 15.0 | - | - |
Technical Details & Test Data
- Hot Strength
Packaging & Availability
- Regional Availability
Storage & Handling
- Shelf Life
- 12 Months
- Storage Condition
- Storage Condition: 8 to 28°C.
- Products should be stored unopened in a cool, dry place out of direct sunlight. Products may be refrigerated for improved shelf life, but should be brought back to room temperature before use.