Bonding Technology

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller 7012 is a one-component reactive adhesive with excellent thermal conductivity, specifically designed for bonding battery cells to module bases in electric vehicle applications. It offers a long open time for easy handling while providing immediate fixture strength. This adhesive belongs to the acrylics and acrylates chemical family and is known for its high strength and good thermal conductivity.

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller 1522 is a two-component condensation-cure silicone material that has a fast room-temperature curing speed and very good adhesion to many different materials. It has very good long-term adhesion performance in high-temperature conditions. 1522 is designed for use in a variety of applications where long-term temperature cycle resistance, UV exposure, and other harsh exposure conditions exist.

H.B. Fuller FH8801 is a one-part acrylate adhesive that undergoes heat curing. It offers fast curing at low temperatures and provides outstanding bond strength. This adhesive is commonly used for chip bonding in microelectronic, MEMS, and opto-electronic applications. It is especially suitable for in-line production as it has the ability to snap cure. FH8801 is an ideal heat cure acrylic for chip bonding and other electronics applications, including electric motors.

Tonsan® 1533 White is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, particularly junction boxes on PV modules. It has excellent dielectric properties and V1 flame retardancy.

H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.

H.B. Fuller 1527, also called 1527SBK, is a black, UL-certified, one-component RTV silicone with super resistance to weathering and ultra violet (UV). This material has very good adhesion without the need for primers to a wide range of substrates. It can be used for a variety of interior and exterior bonding and sealing applications. 1527 Black is formulated to perform at temperatures ranging from -54°C to 210°C.

Tonsan® 1521 Black is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, typically for the junction box on PV modules. It also has good thermal conductivity and flame retardancy.

H.B. Fuller 1521 is a two-component, room-temperature-cure silicone system. It has very low ionic content and can be used for electronic component applications and electronics potting. Its applications include appliance sealing, connector sealing, and junction box potting. Additionally, it has good thermal conductivity and flame retardancy.

Tonsan® 1521 White is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, particularly junction boxes on PV modules. It has good thermal conductivity and flame retardancy.

H.B. Fuller FH8801C is a fast-curing, single-component, electrically conductive adhesive designed for chip bonding in microelectronic, MEMS, and opto-electronic applications. This heat-curable material offers outstanding bond strength and snap cure during in-line production, making it ideal for automated assembly processes.