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Underfills

1 Product found in Underfills

H.B. Fuller FH8008 banner
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H.B. Fuller FH8008
  • Chemical Family:Epoxy & Epoxy Derivatives
  • RTU Product Type:Reactive Adhesive, Underfill Adhesive, 1K (1 component) Adhesive
  • Application Area:Electronic Components
  • Features:Fast Cure, Good Gap Filling Capabilities, Excellent Filling Properties, High Reliability
H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.
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