Products

H.B. Fuller EA6110 is a double-cure adhesive that cures rapidly under UV light or ambient temperature and humidity. It is a no-flow adhesive that is specifically formulated for bonding plastics and metals, and can even cure in shadowed areas. It is ideal for applications that require fast curing times and excellent bonding properties.

H.B. Fuller EA6053H is a fast-curing adhesive that utilizes UV light to cure. The product possesses a soft and flexible nature, while also exhibiting excellent adhesion properties. This adhesive can be used as a replacement for silicone rings in buffering applications. It is capable of providing good adhesion to a variety of substrates, including glass, plastics, and metals.

Cyberbond 1326 is a reactive-chemistry, two-part acrylate adhesive with high strength and impact. It is used in automotive, electronics, and general assembly applications, as well as in the sporting goods and leisure industries. It is typically used with Cyberbond 1094.

Adcobond SCT-100 is a double-sided tape featuring a synthetic elastomer-based adhesive/sealant with a non-woven reinforcement layer. It maintains flexibility and easily conforms to irregular surfaces. This tape has a high tack level, forming strong bonds with various substrates such as polyethylene, EVA, EPDM, and automotive paint systems. Moreover, it establishes a permanent seal against moisture, dust, and air intrusion. The reinforcement layer adds strength and resistance to deformation.

H.B. Fuller UV890SF-150D is a 1-part UV-curable conformal coating adhesive. It is a single-component adhesive with low viscosity and solvent-free properties. UV890SF can be applied using a brush, dip, or spray method. It is commonly used to protect printed circuit boards (PCBs) in various high-reliability applications, making it an ideal conformal coating material for electronic components, including electric motors.

H.B. Fuller EA6031 is a general-purpose, low-viscosity, fast UV-cure adhesive with good flowability. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6031 has shown excellent adhesion and is flexible.

H.B. Fuller EA6402M is a one-component adhesive that can be cured by both UV and thermal methods. This adhesive has a fast curing time at 80℃, and also features low shrinkage, high adhesive strength, and the ability to adhere to a variety of substrates.

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.

Cyberbond CB805 is a reactive chemistry two-part acrylate adhesive known for its excellent bonding of dissimilar substrates and performance under vibration and impact. It is used in outdoor signs, magnets, electronics, and sporting goods and leisure applications in the general industries market.

H.B. Fuller EA6032 is a fast UV-cure adhesive with excellent PVC and PC bonding. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. It has shown excellent adhesion and is flexible.

H.B. Fuller FH8009 is a brown-colored epoxy-based underfill adhesive designed for electronic components, particularly printed circuit boards (PCBs). This ready-to-use product offers excellent flow properties, ensuring smooth and precise application. FH8009 provides high reliability, ensuring secure and long-lasting bonding of components.

H.B. Fuller EA6203 is a fast UV-cured adhesive with high viscosity. It is a general-purpose, one-component adhesive that does not require mixing. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6203 has shown excellent adhesion and is flexible.

H.B. Fuller FH8633 is a one-component, thermal-curable adhesive with fast curing at low temperatures, low shrinkage, and high adhesive strength. It can adhere to a variety of substrates and has excellent thermal performance, making it suitable for high-temperature applications. This material also provides high bond strength on various substrates.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

H.B. Fuller EA6034 is a one-component UV adhesive that cures quickly and is specifically designed for reinforcing Flexible Printed Circuit (FPC) applications. The adhesive dries to a non-tacky surface and offers excellent flexibility. Additionally, this adhesive is fast-curing and does not require mixing.