Products

H.B. Fuller FH8801 is a one-part acrylate adhesive that undergoes heat curing. It offers fast curing at low temperatures and provides outstanding bond strength. This adhesive is commonly used for chip bonding in microelectronic, MEMS, and opto-electronic applications. It is especially suitable for in-line production as it has the ability to snap cure. FH8801 is an ideal heat cure acrylic for chip bonding and other electronics applications, including electric motors.

H.B. Fuller FH7011 is a 1K acrylate anaerobic adhesive specifically designed for metal structure bonding. This adhesive is a one-part acrylic anaerobic adhesive used for bonding ferrites to electro-plated materials in electric motors. Its main uses include structure bonding and serving as an anaerobic adhesive for electric motor bonding in portable devices and electric motors.

Cyberbond 7620 is a versatile adhesive specifically designed for electric motors. It offers high heat resistance and strength, making it ideal for use in automotive electrical and electronic systems. This ready-to-use adhesive is available in a 1K (1 component) formulation, as well as anaerobic adhesive and retainer variants.

H.B. Fuller FH6522 is a one-part epoxy adhesive that is specifically designed for bonding magnets in electric motors. It offers good bonding strength and high strength, making it suitable for demanding applications. The adhesive cures when subjected to heat. It belongs to the epoxy and epoxy derivatives chemical family.

H.B. Fuller EA6033 is a fast UV-cure adhesive. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6033 has shown excellent adhesion and is flexible. It can be used for BGA reinforcement.

H.B. Fuller MP5401 is a one-component, heat-curable, thixotropic epoxy paste adhesive. It is a non-sag adhesive that forms strong bonds to metals and ceramics. H.B. Fuller MP5401 has exceptional thermal stability and resistance to water, humidity, and solvents. This product offers high heat resistance and cures in less than 36 seconds via induction or infrared heating. Its typical uses include permanent magnet motors and loudspeaker assembly, air conditioning joint tubes and processors, high-temperature structural bonding, filter end caps, and side seam assembly.

H.B. Fuller EA6039 is a reactive acrylic adhesive that bonds a wide variety of substrates, including glass, numerous plastics, and most metals. This product has demonstrated remarkable adhesion and flexibility. It is a non-sag, high-strength, and highly flexible adhesive that can be dispensed and jetted at high speeds. It finds application in stacking and corner bonding of electronic components, as well as bonding glass, plastics, and various metals. Additionally, it is commonly used in electric motors.

H.B. Fuller FH8801C is a fast-curing, single-component, electrically conductive adhesive designed for chip bonding in microelectronic, MEMS, and opto-electronic applications. This heat-curable material offers outstanding bond strength and snap cure during in-line production, making it ideal for automated assembly processes.

H.B. Fuller FH6501 is a one-part epoxy adhesive specifically designed for potting and bonding electronic components. It is a heat-curable epoxy that offers excellent thermal conductivity. This product is commonly used in applications requiring thermally conductive properties, such as in electric motors.

Cyberbond Apollo 1603 is a one-part general-purpose cyanoacrylate adhesive. It is used as a fast-curing adhesive in electric motors in the electric vehicle market. This product also meets the following standards: EN ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, and EN ISO 14001:2015.

H.B. Fuller FH8732B is a one-part epoxy adhesive that serves as a heat curable potting material. It offers good flow and is effective at filling gaps at room temperature. This epoxy is primarily used as an excellent heat cure encapsulant with low coefficient of thermal expansion (CTA) in electronics applications, specifically for electric motors.

H.B. Fuller FH8707HF is a black-colored epoxy-based adhesive designed for a wide range of applications in electronic components, printed circuit boards (PCBs), electric motors, and automotive electrical and electronic systems. This heat-curable adhesive offers excellent filling properties, high strength, and good electrical properties. It exhibits improved aging resistance, ensuring long-term durability.

MP-55420 is a high-performance, two-part methacrylate adhesive engineered to bond a wide range of plastics, metals, and composite assemblies. It offers outstanding bond strength, is extremely durable, and has excellent impact and weathering properties. H.B. Fuller MP55420 greatly increases the reliability of finished assemblies with its exceptional flexibility, ability to withstand extreme temperature fluctuations and thermal cycling, and resistance to a wide range of chemicals and environmental conditions.

H.B. Fuller FH1425 is a two-part epoxy adhesive specifically formulated for encapsulating and protecting electronics in challenging environments. This epoxy system offers flexibility, making it suitable for applications where the electronics require a high level of protection. Its primary use is for the protection of electronics, including electric motors, where a highly flexible epoxy resin system is required.

H.B. Fuller FH1270 is a two-part polyurethane (PU) adhesive known for its high solids content and thermosetting properties. It is a non-toxic film used primarily as an insulating compound to coat printed circuit assemblies. This PU adhesive is designed to provide protection against moisture, mold, dust, corrosion, and other extreme environmental stresses. Its main applications include electronics protection and the insulation of electric motors.