Products

Double Bubble Epoxy Extra Fast Setting is a two-component, room temperature curing epoxy adhesive with an extra-fast setting time. It cures at temperatures as low as –18°C (0°F) and has a convenient mix ratio. Known for its excellent cohesive strength, it bonds to various substrates including metal, wood, concrete, ceramics, and many plastics. Ideal for fast patching, fixturing, and repairs requiring quick handling strength, it serves as an excellent general-purpose adhesive.

EV Therm 602 is a two-component, thermally conductive, flame retardant UV curable resin system. It is designed for applications requiring both heat dissipation and flame resistance, offering durability and reliability in demanding industrial environments.

Adcobond SCT-100 is a double-sided tape featuring a synthetic elastomer-based adhesive/sealant with a non-woven reinforcement layer. It maintains flexibility and easily conforms to irregular surfaces. This tape has a high tack level, forming strong bonds with various substrates such as polyethylene, EVA, EPDM, and automotive paint systems. Moreover, it establishes a permanent seal against moisture, dust, and air intrusion. The reinforcement layer adds strength and resistance to deformation.

H.B. Fuller 1527, also called 1527SBK, is a black, UL-certified, one-component RTV silicone with super resistance to weathering and ultra violet (UV). This material has very good adhesion without the need for primers to a wide range of substrates. It can be used for a variety of interior and exterior bonding and sealing applications. 1527 Black is formulated to perform at temperatures ranging from -54°C to 210°C.

H.B. Fuller EV Therm 601 is a one-component UV curable technology that is thermally conductive, flame retardant, and electrically insulative. This material provides an optimum coating with a minimum coating thickness of 150 microns and encapsulation protection for electronic assemblies and components. This material was designed to be thermally conductive and is recommended for use with heatsinks, heat spreaders, cold plates, cooling tubes, and other thermal dissipation applications.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

Tonsan® 1533 Black is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, typically for the junction box on PV modules. It has excellent dielectric properties and V1 flame retardancy.

H.B. Fuller FH8801 is a one-part acrylate adhesive that undergoes heat curing. It offers fast curing at low temperatures and provides outstanding bond strength. This adhesive is commonly used for chip bonding in microelectronic, MEMS, and opto-electronic applications. It is especially suitable for in-line production as it has the ability to snap cure. FH8801 is an ideal heat cure acrylic for chip bonding and other electronics applications, including electric motors.

UR3543ABTF is a two-component, self-leveling viscosity polyurethane that cures at room temperature. This material is perfect for encapsulating, sealing, and protecting electronic assemblies and components. It offers excellent adhesion to a wide range of surfaces, including common metals and engineering plastics, making it a reliable choice for electronic applications.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.